公开(公告)号：US20210111007A1

公开(公告)日：2021-04-15

申请号：US16865493

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang KIM ,  Keonwoo KIM ,  Eungsu KIM ,  Hakyoung KIM ,  Heewon MIN ,  Kyeongtea BANG ,  Seungwon SHIN ,  Dongyun YEO ,  Hyanjung LEE ,  Kyeongseok JEONG

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: An electrostatic chuck includes a chuck plate configured to mount a substrate, an insulation pillar provided outside the chuck plate, the insulation pillar having a pin hole formed therein, a first movable ring provided on the insulation pillar, surrounding a side of the chuck plate, a second movable ring configured to cover at least a part of an upper portion of the first movable ring, and a driving pin configured to move in the pin hole of the insulation pillar in a vertical direction, the driving pin overlapped by at least a part of the first movable ring and at least a part of the second movable ring in the vertical direction. The driving pin is configured to drive the first movable ring and the second movable ring in the vertical direction or to drive the second movable ring in the vertical direction.

公开(公告)号：US20240162017A1

公开(公告)日：2024-05-16

申请号：US18327458

申请日：2023-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heewon MIN ,  Juho KIM ,  Dongyun YEO ,  Kuihyun YOON ,  Seungbin LIM ,  Songyun KANG ,  Youngrok KWON

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/334

Abstract: A substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. The chucking plate may include a heater. The thermal-insulation plate may include an adiabatic space, which is recessed from a top surface of the thermal-insulation plate by a depth in a downward direction. The cooling plate may include a connection hole, which vertically extends and is connected to the adiabatic space.