公开(公告)号：US20240162017A1

公开(公告)日：2024-05-16

申请号：US18327458

申请日：2023-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heewon MIN ,  Juho KIM ,  Dongyun YEO ,  Kuihyun YOON ,  Seungbin LIM ,  Songyun KANG ,  Youngrok KWON

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/334

Abstract: A substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. The chucking plate may include a heater. The thermal-insulation plate may include an adiabatic space, which is recessed from a top surface of the thermal-insulation plate by a depth in a downward direction. The cooling plate may include a connection hole, which vertically extends and is connected to the adiabatic space.