公开(公告)号：US20230411310A1

公开(公告)日：2023-12-21

申请号：US18080024

申请日：2022-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kim Min SIC ,  Jinhyeong KIM ,  Hak-Ryul KIM ,  Inyoung CHOI

IPC: H01L23/60 ,  H01L27/02

CPC classification number: H01L23/60 ,  H01L29/6681 ,  H01L27/0296 ,  H01L27/0292

Abstract: A semiconductor device includes: at least one signal pad including power metal rings and configured to exchange an input/output signal with an input/output circuit; and a dummy power pad disposed adjacent to the at least one signal pad, wherein the dummy power pad includes a first clamp circuit connected to at least one of the power metal rings.