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公开(公告)号:US20230275193A1
公开(公告)日:2023-08-31
申请号:US18088226
申请日:2022-12-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soonmin HONG , Gunwoo KIM , Seonghwan SHIN , Tackmo LEE
CPC classification number: H01L33/483 , H01L25/167 , H01L24/32
Abstract: A display module includes: a substrate; a side wiring extending along a side surface of the substrate, the side wiring electrically connecting a TFT layer of the substrate at a first end of the side wiring with a rear wiring layer of the substrate at a second end of the side wiring; a front cover disposed on and bonded with a mounting surface of the substrate; a metal plate disposed on and bonded with the rear surface; a side cover covering the side wiring and the side surface; a waterproof member configured to seal the second end of the side wiring from outside and prevent moisture permeation; and a side end member disposed on and covering the side cover and the waterproof member, and the side end member being grounded to the metal plate.
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公开(公告)号:US20240203910A1
公开(公告)日:2024-06-20
申请号:US18590302
申请日:2024-02-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tackmo LEE , Changkyu CHUNG , Gunwoo KIM , Soonmin HONG
CPC classification number: H01L23/60 , H01L23/3192 , H01L24/29 , H01L24/32 , H01L25/167 , H01L24/33 , H01L2224/29028 , H01L2224/32145 , H01L2224/32175 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2924/12041 , H01L2924/1426
Abstract: A display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal cover covering the rear surface and a first area of the side surface, the first area extending from the rear surface; and a side member positioned below the outer area from the mounting surface and adhered to a second area of the side surface, the second area extending from the mounting surface, and at least a portion of the metal cover. The metal cover includes a rear portion covering the rear surface, a side portion covering the first area of the side surface, and a bent portion bent between the rear portion and the side portion.
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公开(公告)号:US20250031497A1
公开(公告)日:2025-01-23
申请号:US18906800
申请日:2024-10-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seonghwan SHIN , Gunwoo KIM , Tackmo LEE , Soonmin HONG
IPC: H01L33/56 , H01L25/075 , H01L25/16 , H01L27/15
Abstract: A display module includes: a substrate including a mounting surface having a thin-film transistor (TFT) layer is formed thereon, a side surface, and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface; an anisotropic conductive layer on the TFT layer and configured to electrically connect the TFT layer with the plurality of inorganic light-emitting elements; a front cover for covering the mounting surface; a side cover for surrounding the side surface; and a metal plate adhered to the rear surface. A side end of the front cover extends to a region outside the mounting surface. The side cover is made of a moisture-proof material for preventing moisture from permeating, and extends to at least a part of a side surface of the metal plate from a lower portion of the front cover corresponding to the region outside the mounting surface.
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公开(公告)号:US20240313189A1
公开(公告)日:2024-09-19
申请号:US18674482
申请日:2024-05-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gunwoo KIM , Seongho SON , Jongsung LEE , Changjoon LEE , Seonghwan SHIN , Tackmo LEE , Soonmin HONG
CPC classification number: H01L33/644 , H01L25/167 , H01L27/124
Abstract: A display apparatus includes: a display module array including a plurality of display modules arranged in a matrix, wherein each display module of the plurality of display modules includes: a substrate including a mounting surface and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface of the substrate; a metal plate adhered to the rear surface of the substrate and configured to dissipate heat generated by the substrate; a front cover covering the mounting surface; a first conductive layer on the mounting surface; and a second conductive layer between the front cover and the first conductive layer.
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