公开(公告)号：US20160236318A1

公开(公告)日：2016-08-18

申请号：US15001410

申请日：2016-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-Seok CHOI ,  Chang-Gil RYU ,  Geun-Young SONG ,  Ki-Yeon CHU ,  Jin-Suk HONG

IPC: B24B37/32

CPC classification number: B24B37/32 ,  B24B37/30 ,  B24B55/02

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Abstract translation: 抛光头包括用于吸附和加压基板的基板载体，以及固定在基板载体下方的保持环，保持环围绕基板的圆周并且包括通过其的冷却通道以循环冷却剂流体。