公开(公告)号：US20250100101A1

公开(公告)日：2025-03-27

申请号：US18732911

申请日：2024-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungyoon Kim ,  Eunkyoung Kim ,  Boumyoung Park ,  Hyodong Lee

IPC: B24B37/26

Abstract: A buffing treatment module includes: a buffing table that supports a substrate; a buffing head located on the buffing table and configured to rotate; and a buffing pad attached to a lower part of the buffing head and rotating while in contact with the substrate for performing buffing treatment on the substrate, wherein the buffing pad includes: a base unit; a plurality of protrusion units that protrude from a surface of the base unit and are spaced apart from each other in a circumferential direction of the base unit; and a plurality of trench units positioned adjacent to the plurality of protrusion units, and extending from a center portion of the base unit to an edge portion of the base unit, wherein the plurality of trench units are spaced apart from each other in the circumferential direction of the base unit.

公开(公告)号：US20240051079A1

公开(公告)日：2024-02-15

申请号：US18296021

申请日：2023-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunkyoung Kim ,  Kiho Bae ,  Hoyoung Kim ,  Boumyoung Park ,  Boun Yoon

IPC: B24B37/005 ,  G05D11/13

CPC classification number: B24B37/0056 ,  G05D11/138 ,  H01L21/31053

Abstract: A chemical mechanical polishing apparatus includes: supply pipes to which a slurry stock solution and a diluent are supplied; flow rate control units, respectively disposed on the supply pipes to control flow rates of the slurry stock solution and the diluent; a mixer connected to the flow rate control units and configured to mix the slurry stock solution and the diluent, supplied from the supply pipes, to prepare a slurry; a slurry storage unit connected to the mixer and configured to store the slurry prepared in the mixer; a slurry supply unit configured to draw out the slurry stored in the slurry storage unit and to supply the slurry to a polishing pad; and a control unit configured to control the flow rate control units to control a mixing ratio of the slurry stock solution and the diluent and a flow rate of the slurry to the polishing pad.