公开(公告)号：US20170062675A1

公开(公告)日：2017-03-02

申请号：US15219454

申请日：2016-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-young Lim ,  Tan Sakong ,  Eun-deok Sim ,  Suk-ho Yoon ,  Jeong-wook Lee

IPC: H01L33/58 ,  H01L33/00 ,  H01L33/32 ,  H01L33/16 ,  H01L33/44

CPC classification number: H01L33/58 ,  H01L33/0075 ,  H01L33/486 ,  H01L2933/0025 ,  H01L2933/0058

Abstract: A method of manufacturing a light emitting diode (LED) includes forming a first material layer on a substrate, forming a second material layer on the first material layer, forming a photomask pattern on the second material layer, performing a first etching on the second material layer and a portion of the first material layer by using the photomask pattern as an etch mask, removing the photomask pattern, and forming a plurality of isolated structures by performing a second etching on the remaining portion of the first material layer until a top surface of the substrate is exposed.

Abstract translation: 一种制造发光二极管（LED）的方法包括在基板上形成第一材料层，在第一材料层上形成第二材料层，在第二材料层上形成光掩模图案，对第二材料进行第一蚀刻 层和一部分第一材料层，通过使用光掩模图案作为蚀刻掩模，去除光掩模图案，以及通过对第一材料层的剩余部分进行第二蚀刻形成多个隔离结构，直到第 衬底被暴露。