公开(公告)号：US20250066154A1

公开(公告)日：2025-02-27

申请号：US18429867

申请日：2024-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin KIM ,  Byongjoo KIM

IPC: B65H49/32 ,  B65H69/02 ,  B65H69/04 ,  B65H69/08 ,  H01L23/00

Abstract: A wire supply module may include a plurality of spools and a joint machine. Wires may be wound on the spools. The joint machine may be arranged between the spools to join the wires to each other. The joint machine may include a housing, a jointer and a cutter. The housing may have a joint passage configured to receive ends of the wires. The jointer may be arranged in the housing to join the ends of the wires to each other. The cutter may be arranged in the housing to partially cut the joined ends of the wires. Thus, when all the wire on a currently used spool may be exhausted, the wire on another spool may be joined to the wire on the currently used spool so that the wire may be continuously supplied without a spool exchange.

公开(公告)号：US20250022837A1

公开(公告)日：2025-01-16

申请号：US18524828

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin KIM ,  Byongjoo KIM

IPC: H01L23/00

Abstract: A wire bonding apparatus may include a bonder and a common loader/unloader. The bonder may bond a conductive wire to a plurality of package substrates. The common loader/unloader may load the package substrates into the bonder. The common loader/unloader may unload the package substrates from the bonder. Thus, an occupying area of the wire bonding apparatus in semiconductor fabrication equipment may be reduced to improve a productivity of the semiconductor fabrication equipment.

公开(公告)号：US20220359596A1

公开(公告)日：2022-11-10

申请号：US17719836

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doojin KIM ,  Junetaeg LEE ,  Sungkwan Kim ,  Seokha LEE

IPC: H01L27/146

Abstract: An image sensor is provided. The image sensor includes: a substrate including a pixel array zone; a microlens layer on the substrate in the pixel array zone; a first passivation layer on the microlens layer; and a second passivation layer on the first passivation layer, wherein the microlens layer includes: a first lens pattern; a second lens pattern at a side of the first lens pattern; and a first point where the first lens pattern meets the second lens pattern, and at least one of the first passivation layer and the second passivation layer is on the first lens pattern, the second lens pattern, and the first point.