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公开(公告)号:US20230239595A1
公开(公告)日:2023-07-27
申请号:US18149273
申请日:2023-01-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Takahiko INADA , Dongwook Won , Hyunjin Jeon , Jaeheum Baek
CPC classification number: H04N25/78 , H04N25/7795 , H04N25/77
Abstract: An image sensor includes a pixel array including a first pixel and a second pixel which are connected to a same column line, the first pixel including 2N sub-pixels sharing a first floating diffusion node and the second pixel including 2N sub-pixels sharing a second floating diffusion node, wherein N is a positive integer greater than or equal to two, a timing generator configured to change a reset order and a readout order of 4N sub-pixels included in the first pixel and the second pixel, according to an exposure time setting value, and output a row address according to the changed orders, and a row driver configured to drive the pixel array based on the row address.
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公开(公告)号:US12224295B2
公开(公告)日:2025-02-11
申请号:US17455246
申请日:2021-11-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hakyu Choi , Yongsuk Choi , Keo-Sung Park , Dongwook Won
IPC: H01L27/146
Abstract: A method of manufacturing an image sensor includes forming a first dopant region having a second conductivity type in a semiconductor substrate including first and second surfaces. The semiconductor substrate has a first conductivity type different from the second conductivity type. The method further includes forming a pixel isolation structure defining pixel regions in the semiconductor substrate, forming a vertical trench by patterning the first surface in each of the pixel regions, forming a mask pattern exposing each of the pixel regions on the first surface, in which the mask pattern includes a residual mask pattern filling at least a portion of the vertical trench, forming a second dopant region having the second conductivity type in the semiconductor substrate by using the mask pattern as an ion-implantation mask, in which the second dopant region is adjacent to the vertical trench, and forming a transfer gate electrode in the vertical trench.
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公开(公告)号:US12200386B2
公开(公告)日:2025-01-14
申请号:US18149273
申请日:2023-01-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Takahiko Inada , Dongwook Won , Hyunjin Jeon , Jaeheum Baek
Abstract: An image sensor includes a pixel array including a first pixel and a second pixel which are connected to a same column line, the first pixel including 2N sub-pixels sharing a first floating diffusion node and the second pixel including 2N sub-pixels sharing a second floating diffusion node, wherein N is a positive integer greater than or equal to two, a timing generator configured to change a reset order and a readout order of 4N sub-pixels included in the first pixel and the second pixel, according to an exposure time setting value, and output a row address according to the changed orders, and a row driver configured to drive the pixel array based on the row address.
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