公开(公告)号：US20230098815A1

公开(公告)日：2023-03-30

申请号：US17816759

申请日：2022-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minki CHO ,  Jungsoo KIM ,  Dohyun AHN ,  Wonchul CHO ,  Taeyun KIM ,  Wonjun JEONG ,  Kwangsic CHOI ,  Chonguk HEO

IPC: H04N5/225 ,  G03B17/55

Abstract: A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.