公开(公告)号：US20250046747A1

公开(公告)日：2025-02-06

申请号：US18417810

申请日：2024-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junyun KWEON ,  Wooju KIM ,  Kangil YUN ,  Junho YOON ,  Dayoung CHO ,  Jinwook HONG

IPC: H01L23/00 ,  H01L21/304 ,  H01L21/306 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate and including a first chip pad and a first upper insulating layer on sidewalls of the first chip pad, a first bonding wire on a top surface of the first chip pad and connected to the first chip pad, and a second semiconductor chip on a top surface of the first semiconductor chip and spaced apart from the first chip pad, wherein the second semiconductor chip includes a second semiconductor die and a second lower insulating layer on a bottom surface of the second semiconductor die, wherein the second lower insulating layer may be directly bonded to the first upper insulating layer by a chemical bond between the first upper insulating layer and the second lower insulating layer.