公开(公告)号：US20200184880A1

公开(公告)日：2020-06-11

申请号：US16706093

申请日：2019-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chulgyu JUNG ,  Jinho KIM ,  Sangmin SHIN ,  Hoseop LEE ,  Youngki JUNG

IPC: G09G3/32 ,  H01L25/16 ,  G06F3/14

Abstract: A display apparatus including: a printed circuit board; and a plurality of display modules arranged adjacent in a length direction of the printed circuit board, each display modules of the plurality of the display modules including: a thin film transistor substrate; a plurality of micro LEDs arranged on a surface of the thin film transistor substrate; a flexible printed circuit board (FPCB) through which the printed circuit board and the thin film transistor substrate; and a driver controlling the plurality of micro LEDs disposed on a surface of the FPCB.

公开(公告)号：US20210241682A1

公开(公告)日：2021-08-05

申请号：US17166683

申请日：2021-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki JUNG ,  Tetsuya SHIGETA ,  Jinho KIM ,  Chulgyu JUNG

IPC: G09G3/32 ,  H01L27/15

Abstract: A display panel is provided. The display panel includes a plurality of light-emitting diodes constituting a plurality of sub-pixels of the display panel and configured to be divided into a plurality of groups; and a plurality of LED driving circuits configured to: receive a PWM data voltage in a scanning period; and based on the PWM data voltage, drive the plurality of light-emitting diodes by providing drive current to the plurality of light-emitting diodes for a time corresponding to the PWM data voltage in an emission period, wherein each of the plurality of LED driving circuits is configured to be connected to light-emitting diodes included in respective groups of the plurality of groups, and drive the light-emitting diodes of the respective groups.

公开(公告)号：US20230122312A1

公开(公告)日：2023-04-20

申请号：US18084118

申请日：2022-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki JUNG ,  Sangmin SHIN ,  Kisun KANG ,  Donghwan KIM ,  Chulgyu JUNG

IPC: H01L27/12 ,  G09G3/32 ,  H01L25/16

Abstract: A light-emitting diode (LED) module includes: a glass substrate; a signal wiring layer provided on the glass substrate and including a plurality of electrodes connected by a passive matrix circuit; and a plurality of LEDs connected to the plurality of electrodes and configured to emit light toward the glass substrate, wherein the signal wiring layer further includes a boundary region that divides the LED module into a plurality of unit regions.

公开(公告)号：US20230006120A1

公开(公告)日：2023-01-05

申请号：US17903253

申请日：2022-09-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki JUNG ,  Sangmin SHIN ,  Donghun LEE ,  Chulgyu JUNG

IPC: H01L33/62 ,  H01L33/38 ,  G01R31/26 ,  H01L25/075

Abstract: A light emitting diode (LED) module includes a substrate layer including an active area and a non-active area excluding the active area, at least one wiring layer provided on the substrate layer, and a test pad connected to the at least one wiring layer and provided in the non-active area.

公开(公告)号：US20220376139A1

公开(公告)日：2022-11-24

申请号：US17702414

申请日：2022-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Seungran PARK ,  Youngki JUNG ,  Chulgyu JUNG

IPC: H01L33/38 ,  H01L33/62 ,  H01L25/075

Abstract: A light-emitting diode and a display module using the same is disclosed. The light-emitting diodes includes a first semiconductor layer, an active layer provided on the first semiconductor layer, a second semiconductor layer provided on the active layer, a first chip electrode covering a first portion of an upper surface of the second semiconductor layer and a portion of a first side surface of the second semiconductor layer, and a second chip electrode covering a second portion of the upper surface of the second semiconductor layer different from the first portion of the upper surface of the second semiconductor layer and covering a second side surface of the second semiconductor layer different from the first side surface of the second semiconductor layer.

公开(公告)号：US20210028156A1

公开(公告)日：2021-01-28

申请号：US16886128

申请日：2020-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhee KANG ,  Taesoon PARK ,  Youngki JUNG ,  Chulgyu JUNG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62

Abstract: A display module and a manufacturing method thereof is provided. The display module may include a substrate; a thin film transistor (TFT) layer disposed on a surface of the substrate; a plurality of LED packages including a connection substrate and a plurality of LEDs disposed on a first surface of the connection substrate; and a wiring configured to electrically connect the TFT layer and the plurality of LEDs. The wiring includes a first wiring for electrically coupling with the plurality of LEDs on the first surface, and a second wiring for electrically coupling with the TFT layer on a second surface of the connection substrate.

公开(公告)号：US20220238503A1

公开(公告)日：2022-07-28

申请号：US17723034

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Youngki JUNG ,  Donghwan KIM ,  Yong NAMKUNG ,  Chulgyu JUNG

IPC: H01L25/16 ,  H01L23/00

Abstract: A display module is disclosed. The display module includes a substrate; a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes including an inorganic light-emitting diode that has a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad provided around the mounting groove.