公开(公告)号：US20240063085A1

公开(公告)日：2024-02-22

申请号：US18118983

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mihyae PARK ,  Chiwoo LEE

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H10B80/00

CPC classification number: H01L23/3737 ,  H01L24/32 ,  H01L23/3128 ,  H01L23/5385 ,  H10B80/00 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/83855 ,  H01L2224/16225 ,  H01L24/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L24/73 ,  H01L2224/73253 ,  H01L2224/33181 ,  H01L24/33

Abstract: A semiconductor package including a first semiconductor chip and a second semiconductor chip on a first substrate, a thermal conductive adhesive layer on the first semiconductor chip and the second semiconductor chip and including a resin layer, the resin layer including a first heat dissipation filler, the first heat dissipation filler including a liquid metal, and the semiconductor package further including a heat dissipation member on the thermal conductive adhesive layer.

公开(公告)号：US20220199594A1

公开(公告)日：2022-06-23

申请号：US17561084

申请日：2021-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seonghwan SHIN ,  Sungsoo JUNG ,  Hyeongik KIM ,  Yonghan YOON ,  Kwangjae LEE ,  Chiwoo LEE

IPC: H01L25/13 ,  H01L25/075 ,  H01L33/62

Abstract: Provided is a display module including: a substrate including a mounting surface on which a plurality of inorganic light emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; a front cover bonded to and covering the mounting surface; a metal plate bonded to the rear surface; and a side cover configured to surround the side surface, wherein the front cover extends to an area outside of the mounting surface in a first direction in which the mounting surface extends, and wherein the side cover is provided to extend, in a second direction in which the mounting surface faces, from an upper side of the metal plate to a lower end of a region of the front cover to seal the side surface from an outside.