公开(公告)号：US20250138439A1

公开(公告)日：2025-05-01

申请号：US18793124

申请日：2024-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG HO HWANG ,  JAE HONG LIM ,  CHUL MIN CHO ,  SANG HYUN LIM ,  YOUNG KYUN IM ,  SEOK HEO

IPC: G03F7/00 ,  G03F7/20

Abstract: A substrate processing apparatus includes a process chamber having a space in which a substrate is disposed and processed in the process chamber, a supporter disposed in the process chamber and configured to support and rotate the substrate, a heater disposed in the process chamber and configured to heat a first surface of the substrate, where the heater includes one or more irradiation modules for generating light pulses and directing the light pulses to the first surface of the substrate, a controller configured to control an intensity of the light pulse generated by each of the one or more irradiation modules of the heater, and a fluid supplier configured to supply fluid to the first surface of the substrate.