公开(公告)号：US20230325577A1

公开(公告)日：2023-10-12

申请号：US17903070

申请日：2022-09-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEORIM MOON ,  BONHYUN GU ,  SOOYONG LEE

IPC: G06F30/398

CPC classification number: G06F30/398 ,  G06F2119/02

Abstract: A method of manufacturing a semiconductor chip includes; generating a layout pattern, performing Process Proximity Correction (PPC) on the layout pattern to generate a PPC layout pattern, wherein the performing of PPC includes verifying the PPC layout pattern using machine learning, performing Optical Proximity Correction (OPC) on the PPC layout pattern to generate an OPC layout pattern, manufacturing a mask using the OPC layout pattern, and manufacturing a semiconductor chip using the mask.