公开(公告)号：US12032502B2

公开(公告)日：2024-07-09

申请号：US18115474

申请日：2023-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Aniroop Mathur ,  Archit Tekriwal ,  Anil Kumar ,  Kuldeep Kumar

IPC: G06F13/26 ,  G06F3/023

CPC classification number: G06F13/26 ,  G06F3/023

Abstract: A first electronic device for communication with a second electronic device on a single wire interface, includes: a memory; and a processor executing an application stored in the memory. The processor is configured to: receive, from the second electronic device, interrupt signals related with a frequency and a time space, over the single wire interface; decode an input data associated with the interrupt signals based on an interrupt protocol table; and provide the decoded input data to the application on the first electronic device.

公开(公告)号：US12235192B2

公开(公告)日：2025-02-25

申请号：US17882903

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Prash Goel ,  Kunal Aggarwal ,  Gaurav Gupta ,  Arindam Mondal ,  Aniroop Mathur ,  Archit Tekriwal

IPC: G01M7/08 ,  G06N5/022

Abstract: Embodiments disclosed herein relate to electronic devices, and more particularly to estimating a damage risk level for an electronic device. A method disclosed herein includes measuring motion parameters of the electronic device, on the electronic device being dropped on a surface. The method further includes classifying the surface into at least one type by processing the measured motion parameters using a classifier module. The method further includes estimating a damage risk score depicting the damage risk level for the electronic device based on the classified surface, the measured motion parameters of the electronic device, and a usage history of the electronic device.

公开(公告)号：US20230029857A1

公开(公告)日：2023-02-02

申请号：US17882903

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Prash GOEL ,  Kunal Aggarwal ,  Gaurav Gupta ,  Arindam Mondal ,  Aniroop Mathur ,  Archit Tekriwal

IPC: G01M7/08 ,  G06N5/02

Abstract: Embodiments disclosed herein relate to electronic devices, and more particularly to estimating a damage risk level for an electronic device. A method disclosed herein includes measuring motion parameters of the electronic device, on the electronic device being dropped on a surface. The method further includes classifying the surface into at least one type by processing the measured motion parameters using a classifier module. The method further includes estimating a damage risk score depicting the damage risk level for the electronic device based on the classified surface, the measured motion parameters of the electronic device, and a usage history of the electronic device.