公开(公告)号：US20230397330A1

公开(公告)日：2023-12-07

申请号：US17901402

申请日：2022-09-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Ho Choi ,  Seong II Jeon

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K2201/0275 ,  H05K2201/09554

Abstract: A printed circuit board includes an insulating layer, and a first wiring layer at least partially embedded in one surface of the insulating layer, one surface of the first wiring layer being exposed from the one surface of the insulating layer. The insulating layer includes a first insulating layer covering at least a portion of a side surface of the first wiring layer, and a second insulating layer disposed on the first insulating layer and the first wiring layer, and the first and second insulating layers include different insulating materials.