公开(公告)号：US11798747B2

公开(公告)日：2023-10-24

申请号：US17971914

申请日：2022-10-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Seok Yi ,  Il Ro Lee ,  Chang Hak Choi ,  Bon Seok Koo ,  Jung Min Kim ,  Byung Woo Kang ,  San Kyeong

IPC: H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218

Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.

公开(公告)号：US10199166B2

公开(公告)日：2019-02-05

申请号：US15806112

申请日：2017-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： No Il Park ,  Byeong Cheol Moon ,  Il Ro Lee ,  Hyun Ho Shin ,  Seung Mo Lim ,  In Young Kang

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01G4/06 ,  H01G4/30 ,  H01G4/228

Abstract: A capacitor includes: a substrate including a plurality of trenches and a capacitance formation portion, and a margin portion disposed around the capacitance formation portion; dielectric layers disposed on one surface of the substrate and filling the trenches; a plurality of first electrode layers each disposed on one surface of the dielectric layer and each including a first lead portion led out from the capacitance formation portion to the margin portion; and a plurality of second electrode layers each disposed on one surface of the dielectric layer to face the first electrode layer with each of the dielectric layers interposed therebetween, and each including a second lead portion led out from the capacitance formation portion to the margin portion, wherein the first and second lead portions of the plurality of first and second electrode layers are stacked in a stepped shape inclined in a direction from the margin portion to the capacitance formation portion.

公开(公告)号：US11935703B2

公开(公告)日：2024-03-19

申请号：US18094668

申请日：2023-01-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Seok Yi ,  Jung Min Kim ,  Bon Seok Koo ,  Chang Hak Choi ,  Il Ro Lee ,  Byung Woo Kang ,  San Kyeong ,  Hae Sol Kang

IPC: H01G4/30 ,  H01G2/02 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/02 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

公开(公告)号：US11636984B2

公开(公告)日：2023-04-25

申请号：US17733068

申请日：2022-04-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Seok Yi ,  Jung Min Kim ,  Bon Seok Koo ,  Chang Hak Choi ,  Il Ro Lee ,  Byung Woo Kang ,  San Kyeong ,  Hae Sol Kang

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G2/02

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

公开(公告)号：US11469051B2

公开(公告)日：2022-10-11

申请号：US17233235

申请日：2021-04-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hye Han ,  Jung Min Kim ,  Jae Seok Yi ,  Hye Jin Park ,  Byung Woo Kang ,  Jeong Ryeol Kim ,  Bon Seok Koo ,  Il Ro Lee

IPC: H01G4/30 ,  H01G4/012 ,  H05K1/18 ,  H01G4/12 ,  H01G4/248

Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 μm or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.

公开(公告)号：US11651901B2

公开(公告)日：2023-05-16

申请号：US17462726

申请日：2021-08-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Il Ro Lee ,  Jung Min Kim ,  Hong Je Choi ,  Sang Wook Lee ,  Seon Ho Park ,  Jeong Ryeol Kim ,  Bon Seok Koo

IPC: H01G4/30 ,  H01G4/012 ,  H01G2/06 ,  H01G4/12 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 μm.

公开(公告)号：US11508522B2

公开(公告)日：2022-11-22

申请号：US16857264

申请日：2020-04-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Seok Yi ,  Il Ro Lee ,  Chang Hak Choi ,  Bon Seok Koo ,  Jung Min Kim ,  Byung Woo Kang ,  San Kyeong

IPC: H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.

公开(公告)号：US20220165500A1

公开(公告)日：2022-05-26

申请号：US17462726

申请日：2021-08-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Il Ro Lee ,  Jung Min Kim ,  Hong Je Choi ,  Sang Wook Lee ,  Seon Ho Park ,  Jeong Ryeol Kim ,  Bon Seok Koo

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/06

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 μm.

公开(公告)号：US10720280B2

公开(公告)日：2020-07-21

申请号：US16436031

申请日：2019-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Ho Shin ,  Woong Do Jung ,  Young Seok Yoon ,  Dong Sik Yoo ,  No Il Park ,  Seung Mo Lim ,  Il Ro Lee

IPC: H01G4/232 ,  H01G4/33 ,  H01G4/38 ,  H01G4/008 ,  H01G4/12 ,  H01L49/02

Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.

公开(公告)号：US10468187B2

公开(公告)日：2019-11-05

申请号：US15621136

申请日：2017-06-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Ho Shin ,  Woong Do Jung ,  Young Seok Yoon ,  Dong Sik Yoo ,  No Il Park ,  Seung Mo Lim ,  Il Ro Lee

IPC: H01G4/232 ,  H01G4/33 ,  H01G4/30 ,  H01G4/38 ,  H01G4/008

Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.