公开(公告)号：US20150170823A1

公开(公告)日：2015-06-18

申请号：US14284236

申请日：2014-05-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Jin JEONG ,  Sung Hoon KIM ,  Byung Seung MIN

IPC: H01F27/28 ,  H01F41/04 ,  C25D7/00 ,  H01F27/24

CPC classification number: C25D7/001 ,  C25D5/022 ,  C25D5/10 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/046 ,  H01F2017/048

Abstract: There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a/b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.

Abstract translation: 提供了一种芯片电子部件，包括：包括绝缘基板的磁体; 形成在所述绝缘基板的至少一个表面上的内部线圈部; 以及外部电极，形成在所述磁性体的端面上并且与所述内部线圈部连接，所述内部线圈部包括形成在所述绝缘基板上的第一线圈图案和形成为涂覆所述第一线圈图案的第二线圈图案，以及 第一线圈图案的上表面的宽度a相对于第一线圈图案的下表面的宽度b的比a / b小于1。

公开(公告)号：US20180019050A1

公开(公告)日：2018-01-18

申请号：US15478584

申请日：2017-04-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Seung MIN

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A coil component includes a substrate and a coil portion disposed on at least one surface thereof. The coil portion includes a first coil pattern disposed on one surface of the substrate, a first insulating layer covering the first coil pattern and having a first surface facing the substrate and a second surface opposing the first surface, and an intermediate layer including third and fourth surfaces opposing each other, the third surface being disposed to face the second surface of the first insulating layer, and average surface roughness of the fourth surface being lower than that of the second surface. The coil portion further includes a second coil pattern disposed on the fourth surface of the intermediate layer and connected to the first coil pattern through a conductive via, and a second insulating layer disposed in a space between the fourth surface and the second coil pattern.

公开(公告)号：US20130118792A1

公开(公告)日：2013-05-16

申请号：US13672063

申请日：2012-11-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Seung MIN

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/02 ,  H05K3/10 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/054 ,  H05K2203/058 ,  H05K2203/0723

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, including: applying a solder resist to an insulating material; forming a cavity in the insulating material and the solder resist; forming a seed layer on a surface of the insulating material including the inside of the cavity; forming circuit patterns by plating the inside of the cavity; removing the seed layer formed on the surface of the solder resist; reapplying the solder resist on the solder resist from which the seed layer is removed; and opening a bump forming region of the reapplied solder resist, whereby micro circuits can be easily implemented.

Abstract translation: 本发明公开了一种印刷电路板的制造方法，其特征在于，包括：向绝缘材料施加阻焊剂; 在绝缘材料和阻焊剂中形成空腔; 在包括所述空腔内部的所述绝缘材料的表面上形成种子层; 通过电镀内腔形成电路图案; 去除形成在阻焊剂表面上的种子层; 将阻焊剂重新施加到去除种子层的阻焊层上; 并且打开重新施加的阻焊剂的凸块形成区域，从而可以容易地实现微电路。