公开(公告)号：US20220261049A1

公开(公告)日：2022-08-18

申请号：US17454512

申请日：2021-11-11

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： HYOSEOK YUN ,  TAEGON KIM ,  MYOUNGSEOP SONG ,  JONGMIN SHIM ,  JANG-MI LEE ,  KIHYUN PYUN

IPC: G06F1/18 ,  G09G3/20

Abstract: A circuit board assembly includes a main board and a connection board attached to the main board. The connection board includes a base board including a connecting pad area and a mounting area, wherein the connection board is attached to the main board in the connecting pad area, and wherein the mounting area is spaced apart from the connecting pad area in a first direction and includes a driving chip mounted thereon. The connection board further includes first connection pads disposed on the connecting pad area of the base board, and second connection pads disposed on the connecting pad area of the base board. The main board includes first main pads connected to the first connection pads in a one-to-one connection and a second main pad connected to the second connection pads in a many-to-one connection.