公开(公告)号：US08987035B2

公开(公告)日：2015-03-24

申请号：US13518667

申请日：2010-12-21

申请人： Ron Laird ,  Scott Freeborn ,  Archie Shaw Stewart

发明人： Ron Laird ,  Scott Freeborn ,  Archie Shaw Stewart

IPC分类号： H01L31/18 ,  H01L27/146 ,  H05K3/34 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/101

CPC分类号： H01L27/1465 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/18 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/15312 ,  H05K3/34 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/10318 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing an infrared light detector (1) has the steps of: providing a plurality of connection pins (11, 12), which are kept parallel to one another and arranged with one of the longitudinal ends (17, 18) thereof in a horizontal plane, and a printed circuit board (6) with a planar underside (8), in which a recess (15, 16) of the same form in each case is provided for each of the connection pins (11, 12); filling the recesses (15, 16) with a solder paste, so that in each of the recesses (15, 16) there is a solder paste body (21) with the same amount of solder paste; positioning the printed circuit board (6) over the connection pins (11, 12), so that each of the connection pins (11, 12) extends with its longitudinal end (17, 18) in the recess (15, 16) assigned to it and dips in the solder paste body (21) located in the respective recess (15, 16); liquefying the solder paste bodies (21), so that electrically conducting connections are formed between the connection pins (11, 12) and the solder paste bodies (21) and, on account of the surface tension in the solder paste bodies (21) and the dead weight of the printed circuit board (6), the underside (8) of the printed circuit board (6) is aligned parallel to the horizontal plane; solidifying the solder paste bodies (21), so that mechanically secure connections are formed by the solder paste bodies (21) between the printed circuit board (6) and the connection pins (11, 12) and the alignment of the underside (8) of the printed circuit board (6) parallel to the horizontal plane is fixed.

摘要翻译： 一种制造红外光检测器（1）的方法，包括以下步骤：提供多个连接销（11,12），所述多个连接销（11,12）保持彼此平行并且布置成其纵向端部（17,18）之一 一个水平平面和一个具有平面下侧（8）的印刷电路板（6），每个连接销（11,12）为每个壳体提供了相同形式的凹槽（15,16）。 用焊膏填充凹部（15,16），使得在每个凹部（15,16）中存在焊膏体（21），其具有相同量的焊膏; 将印刷电路板（6）定位在连接销（11,12）上方，使得每个连接销（11,12）的纵向端（17,18）延伸到分配给 它位于相应凹口（15,16）中的焊膏体（21）中并浸没; 使焊膏体（21）液化，从而在连接销（11,12）和焊膏体（21）之间形成导电连接，并且由于焊膏体（21）的表面张力和 印刷电路板（6）的重量，印刷电路板（6）的下侧（8）平行于水平面排列; 固化焊膏体（21），使得机械固定的连接由印刷电路板（6）和连接销（11,12）之间的焊膏体（21）形成，并且下侧（8）的对准 的平行于水平面的印刷电路板（6）是固定的。

公开(公告)号：US20120329198A1

公开(公告)日：2012-12-27

申请号：US13518667

申请日：2010-12-21

申请人： Ron Laird ,  Scott Freeborn ,  Archie Shaw Stewart

发明人： Ron Laird ,  Scott Freeborn ,  Archie Shaw Stewart

IPC分类号： H01L31/18

CPC分类号： H01L27/1465 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/18 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/15312 ,  H05K3/34 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/10318 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing an infrared light detector (1) has the steps of: providing a plurality of connection pins (11, 12), which are kept parallel to one another and arranged with one of the longitudinal ends (17, 18) thereof in a horizontal plane, and a printed circuit board (6) with a planar underside (8), in which a recess (15, 16) of the same form in each case is provided for each of the connection pins (11, 12); filling the recesses (15, 16) with a solder paste, so that in each of the recesses (15, 16) there is a solder paste body (21) with the same amount of solder paste; positioning the printed circuit board (6) over the connection pins (11, 12), so that each of the connection pins (11, 12) extends with its longitudinal end (17, 18) in the recess (15, 16) assigned to it and dips in the solder paste body (21) located in the respective recess (15, 16); liquefying the solder paste bodies (21), so that electrically conducting connections are formed between the connection pins (11, 12) and the solder paste bodies (21) and, on count of the surface tension in the solder paste bodies (21) and the dead weight of the printed circuit board (6), the underside (8) of the printed circuit board (6) is aligned parallel to the horizontal plane; solidifying the solder paste bodies (21), so that mechanically secure connections are formed by the solder paste bodies (21) between the printed circuit board (6) and the connection pins (11, 12) and the alignment of the underside (8) of the printed circuit board (6) parallel to the horizontal plane is fixed.

摘要翻译： 一种制造红外光检测器（1）的方法，包括以下步骤：提供多个连接销（11,12），所述多个连接销（11,12）保持彼此平行并且布置成其纵向端部（17,18）之一 一个水平平面和一个具有平面下侧（8）的印刷电路板（6），每个连接销（11,12）为每个壳体提供了相同形式的凹槽（15,16）。 用焊膏填充凹部（15,16），使得在每个凹部（15,16）中存在焊膏体（21），其具有相同量的焊膏; 将印刷电路板（6）定位在连接销（11,12）上方，使得每个连接销（11,12）的纵向端（17,18）延伸到分配给 它位于相应凹口（15,16）中的焊膏体（21）中并浸没; 液化焊膏体（21），使得在连接销（11,12）和焊膏体（21）之间形成导电连接，并且根据焊锡膏体（21）中的表面张力和 印刷电路板（6）的重量，印刷电路板（6）的下侧（8）平行于水平面排列; 固化焊膏体（21），使得机械固定的连接由印刷电路板（6）和连接销（11,12）之间的焊膏体（21）形成，并且下侧（8）的对准 的平行于水平面的印刷电路板（6）是固定的。