公开(公告)号：US09069145B2

公开(公告)日：2015-06-30

申请号：US14047428

申请日：2013-10-07

Applicant: ROHM CO., LTD.

Inventor： Akira Obika

IPC: G02B6/36 ,  G02B6/42 ,  H01L31/18 ,  H01L33/58 ,  H01L23/31 ,  H01L23/00 ,  H01S5/022 ,  H01L27/146 ,  H01L33/54

CPC classification number: G02B6/4251 ,  G02B6/4203 ,  G02B6/423 ,  H01L23/31 ,  H01L23/3135 ,  H01L24/97 ,  H01L27/14618 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01S5/02252 ,  H01L2924/00

Abstract: An optical communication module according to the present invention includes an optical semiconductor element including an optical function region that performs light-receiving function or light-emitting function, a first resin member which covers the optical semiconductor element and is made of a resin that transmits light emitted from the optical function region or light to be received by the optical function region, and a second resin member which covers the first resin member. A portion of the first resin member is exposed from the second resin member. The optical communication module further includes an attachment hole for attaching an optical fiber. The attachment hole includes an opening that opens at the portion of the first resin member which is exposed from the second resin member.

Abstract translation: 根据本发明的光通信模块包括：光半导体元件，包括执行光接收功能或发光功能的光功能区域;覆盖光半导体元件并由透光的树脂制成的第一树脂构件 从光学功能区域发射的光或由光学功能区域接收的光;以及覆盖第一树脂构件的第二树脂构件。 第一树脂构件的一部分从第二树脂构件露出。 光通信模块还包括用于连接光纤的附接孔。 所述安装孔包括在所述第一树脂构件的从所述第二树脂构件露出的部分处开口的开口。

公开(公告)号：US09128261B2

公开(公告)日：2015-09-08

申请号：US14047398

申请日：2013-10-07

Applicant: ROHM CO., LTD.

Inventor： Akira Obika

IPC: G02B6/36 ,  G02B6/42 ,  H01S5/022

CPC classification number: G02B6/4253 ,  G02B6/4202 ,  G02B6/4212 ,  G02B6/423 ,  G02B6/424 ,  G02B6/4274 ,  H01S5/02252

Abstract: An optical communication module according to the present invention includes an optical semiconductor element with an optical function region that performs light-receiving function or light-emitting function, while also including a first resin member covering the optical semiconductor element and made of a resin that transmits light emitted from the optical function region or light to be received by the optical function region, and a second resin member covering the first resin member. The optical communication module includes an attachment hole for attaching an optical fiber. The attachment hole exposes a part of the first resin member and is open at an outer surface of the second resin member.

Abstract translation: 根据本发明的光通信模块包括具有执行光接收功能或发光功能的光学功能区域的光学半导体元件，同时还包括覆盖光学半导体元件并由透射的树脂制成的第一树脂构件 从光学功能区域发射的光或由光学功能区域接收的光，以及覆盖第一树脂构件的第二树脂构件。 光通信模块包括用于连接光纤的附接孔。 附着孔露出第一树脂构件的一部分，并且在第二树脂构件的外表面处开放。

公开(公告)号：US08981413B2

公开(公告)日：2015-03-17

申请号：US14188064

申请日：2014-02-24

Applicant: Rohm Co., Ltd.

Inventor： Akira Obika

IPC: G02B6/42 ,  H01L33/54 ,  H01L31/0232 ,  H01L33/58 ,  H01L31/18

CPC classification number: H01L31/02325 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2224/48095 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An optical communication module includes an optical semiconductor element. The element includes an optical functional region having a light receiving function or a light emitting function, a first transmission layer transmissive to light emitted from the optical functional region or light received by the optical functional region, and a wiring layer stacked on the first transmission layer and constituting a conduction path to the optical functional region. The communication module also includes a second transmission layer transmissive to the light and disposed to cover the optical semiconductor element, and a first resin member stacked on the second transmission layer. The communication module is formed with a fixing hole for fixing an optical fiber. The fixing hole includes a bottom face provided by the second transmission layer, and an opening formed in an outer surface of the first resin member.

Abstract translation: 光通信模块包括光半导体元件。 该元件包括具有光接收功能或发光功能的光学功能区域，对从光学功能区域发射的光或由光学功能区域接收的光透射的第一透射层，以及堆叠在第一透射层 并且构成到光学功能区域的传导路径。 通信模块还包括透光的第二透射层并且被设置成覆盖光学半导体元件，以及堆叠在第二透射层上的第一树脂构件。 通信模块形成有用于固定光纤的固定孔。 固定孔包括由第二透射层提供的底面和形成在第一树脂构件的外表面中的开口。