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公开(公告)号：US11749539B1
公开(公告)日：2023-09-05
申请号：US17003667
申请日：2020-08-26
Applicant: Rockwell Collins, Inc.
Inventor： Richard Korneisel , Nathaniel P. Wyckoff , Brandon C. Hamilton , Kyle B. Snyder , Jenny Calubayan
IPC: H01L21/67 , H01L21/306 , H01L21/48
CPC classification number: H01L21/6708 , H01L21/30604 , H01L21/4803
Abstract: Systems and methods for selectively etching features in an electronic substrate via a precision dispense apparatus and precision etchant dispense tool are disclosed. The method includes creating a toolpath instruction for etching at least one feature in the substrate, programming the precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit etchant material onto the surface of the substrate to etch the substrate surface to produce the at least one feature according to the created toolpath instruction. The capabilities of the systems and methods disclosed herein extend to 3D substrates and post-build processing, among others.
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公开(公告)号：US11626286B1
公开(公告)日：2023-04-11
申请号：US17002605
申请日：2020-08-25
Applicant: Rockwell Collins, Inc.
Inventor： Jenny Calubayan , Richard Korneisel , Nathaniel P. Wyckoff , Brandon C. Hamilton , Kyle B. Snyder
Abstract: Systems and methods for custom photolithography masking via a precision dispense apparatus and process are disclosed. Methods include creating a toolpath instruction for depositing opaque onto a substrate, programming a precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit opaque material onto the substrate to form the photomask. The substrate may be an optically transparent plate or film or may be an electronic substrate where the opaque material is deposited directly onto a photoresist coating. Capabilities of the systems and methods disclosed herein extend to 3D substrates and custom photolithography masking, among others.
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