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公开(公告)号：US20050098880A1
公开(公告)日：2005-05-12
申请号：US10849097
申请日：2004-05-19
申请人： Richard Torkington , Jon Filreis , Kenneth Buer
发明人： Richard Torkington , Jon Filreis , Kenneth Buer
IPC分类号： H01L23/24 , H01L23/44 , H01L23/053
CPC分类号： H01L23/44 , H01L2224/48091 , H01L2924/1305 , H01L2924/00014 , H01L2924/00
摘要： Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.
摘要翻译： 通过添加导热流体可以减少与在半导体上产生热量的小几何电子特征相关联的热扩散阻力。 例如，可以在半导体封装和半导体衬底之间的体积内使用电介质流体。 因此，可以采用直接热冷却来降低MMIC功率放大器器件中经常遇到的耐热扩散电阻。 此外，本文描述了实现该密封的示例性方法。
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公开(公告)号：US20090231055A1
公开(公告)日：2009-09-17
申请号：US12403292
申请日：2009-03-12
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H01P5/00
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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公开(公告)号：US07157793B2
公开(公告)日：2007-01-02
申请号：US10849097
申请日：2004-05-19
CPC分类号： H01L23/44 , H01L2224/48091 , H01L2924/1305 , H01L2924/00014 , H01L2924/00
摘要： Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.
摘要翻译： 通过添加导热流体可以减少与在半导体上产生热量的小几何电子特征相关联的热扩散阻力。 例如，可以在半导体封装和半导体衬底之间的体积内使用电介质流体。 因此，可以采用直接热冷却来降低MMIC功率放大器器件中经常遇到的耐热扩散电阻。 此外，本文描述了实现该密封的示例性方法。
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公开(公告)号：US08598966B2
公开(公告)日：2013-12-03
申请号：US13472231
申请日：2012-05-15
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H01P5/12
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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公开(公告)号：US07782156B2
公开(公告)日：2010-08-24
申请号：US11853287
申请日：2007-09-11
申请人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
发明人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
CPC分类号： H01P5/107 , H01L23/66 , H01L2223/6633 , H01L2224/48091 , H01L2924/19039 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.
摘要翻译： 通常，根据本发明的示例性方面，公开了用于将诸如单片微波集成电路的集成电路连接到诸如波导的能量传输装置的低损耗接口。 在一个示例性实施例中，接口包括连接到匹配网络的引脚，其将电路产生的能量的阻抗与波导所需的阻抗匹配，而不使用电介质材料。
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公开(公告)号：US20090066441A1
公开(公告)日：2009-03-12
申请号：US11853287
申请日：2007-09-11
申请人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
发明人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
IPC分类号： H03H7/38
CPC分类号： H01P5/107 , H01L23/66 , H01L2223/6633 , H01L2224/48091 , H01L2924/19039 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.
摘要翻译： 通常，根据本发明的示例性方面，公开了用于将诸如单片微波集成电路的集成电路连接到诸如波导的能量传输装置的低损耗接口。 在一个示例性实施例中，接口包括连接到匹配网络的引脚，其将电路产生的能量的阻抗与波导所需的阻抗匹配，而不使用电介质材料。
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公开(公告)号：US20120229219A1
公开(公告)日：2012-09-13
申请号：US13472231
申请日：2012-05-15
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H03F3/14
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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公开(公告)号：US08212631B2
公开(公告)日：2012-07-03
申请号：US12403292
申请日：2009-03-12
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H01P5/12
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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