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1.
公开(公告)号:US20200071565A1
公开(公告)日:2020-03-05
申请号:US16549150
申请日:2019-08-23
发明人: Donggeun JUNG , Wonjin BAN , Sungyool KWON , Yoonsoo PARK , Hyuna LIM , Younghyun KIM
IPC分类号: C09D183/10 , C08G77/06 , C08G77/42 , C09D183/04 , C09D5/00 , H01L23/532 , H01L23/522 , H01L21/02
摘要: A plasma polymerized thin film having low dielectric constant prepared by depositing a first precursor material represented by the following Chemical Formula 1: wherein in the above Chemical Formula 1, R1 to R14 are each independently H or a substituted or non-substituted C1-C5 alkyl group, and when the R1 to R14 are substituted, their substituents comprise an amino group, a hydroxyl group, a cyano group, a halogen group, a nitro group, or a methoxy group.
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公开(公告)号:US20180371419A1
公开(公告)日:2018-12-27
申请号:US16012038
申请日:2018-06-19
发明人: Donggeun JUNG , Sungyool KWON , Wonjin BAN , Hyuna LIM , Yoonsoo PARK
IPC分类号: C12N5/0775 , C23C16/50 , B05D1/00
摘要: The present disclosure relates to a method of fabricating a substrate for culturing stem cells, including forming a plasma polymer layer from a precursor material on a substrate using plasma, and the precursor material contains a heteroaromatic compound or a linear compound.
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