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公开(公告)号：US11081438B2
公开(公告)日：2021-08-03
申请号：US16547294
申请日：2019-08-21
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Yoshiaki Sato , Yoshinori Miyaki , Junichi Arita
Abstract: An object of the present invention is to improve manufacturing efficiency of a semiconductor device. The method of manufacturing a semiconductor device includes a sealing step of sealing a semiconductor chip mounted on the wiring substrate. The sealing step includes a step of arranging the wiring substrate between an upper mold and a lower mold, suctioning a lower surface of the wiring substrate with the plurality of suction holes, thereby holding the wiring substrate the upper mold, and a step of sealing the semiconductor chip, an upper surface of the wiring substrate, and the plurality of side surfaces of the wiring substrate such that each of the semiconductor chip, the upper surface of the wiring substrate, and the plurality of side surfaces of the wiring substrate is covered with the resin in the lower mold.
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公开(公告)号：US10098179B2
公开(公告)日：2018-10-09
申请号：US14258246
申请日：2014-04-22
Applicant: Renesas Electronics Corporation
Inventor： Shintaro Yamamichi , Hirokazu Honda , Masaki Watanabe , Junichi Arita , Norio Okada , Jun Ueno , Masashi Nishimoto , Michitaka Kimura , Tomohiro Nishiyama
Abstract: A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).
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