公开(公告)号：US20150097290A1

公开(公告)日：2015-04-09

申请号：US14045974

申请日：2013-10-04

Applicant: Raytheon Company

Inventor： Barry J. Liles ,  Kamal Tabatabale ,  Frederick A. Rose ,  Christopher J. MacDonald ,  Paul M. Ryan ,  Kurt V. Smith ,  Irl W. Smith

IPC: H01L23/532

CPC classification number: H01L23/53238 ,  H01L23/4821 ,  H01L29/41758 ,  H01L29/8124 ,  H01L2924/13063 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure having first and second electrical conductors disposed on a surface of the structure and a bridging conductor connected between the first electrical conductor and the second electrical conductor with portions disposed over the surface of the structure. The bridging conductor includes a plurality of stacked, multi-metal layers, each one of the multi-metal layers having: an electrically conductive layer; and a pair of barrier metal layers, the electrically conductive layer being disposed between and in direct contact with the pair of barrier metal layers.

Abstract translation: 一种结构，其具有布置在该结构的表面上的第一和第二电导体以及连接在第一电导体和第二电导体之间的桥接导体，其中部分设置在该结构的表面上。 桥接导体包括多个层叠的多金属层，每个多金属层具有：导电层; 以及一对势垒金属层，所述导电层设置在所述一对势垒金属层之间并与所述一对势垒金属层直接接触。