公开(公告)号：US12009805B2

公开(公告)日：2024-06-11

申请号：US17434362

申请日：2020-03-16

申请人： RF360 SINGAPORE PTE. LTD

发明人： Thomas Bauer ,  Ansgar Schäufele ,  Thomas Dengler

IPC分类号： H03H9/64 ,  H03H9/02 ,  H03H9/145

CPC分类号： H03H9/6453 ,  H03H9/02637 ,  H03H9/02834 ,  H03H9/14541

摘要： An improved DMS filter with electrode structures between a first port and a second port is provided. Wiring junctions are realized in multilayer crossing with dielectric material in between. There are insulating patches (L2) between crossing conductor layers (L1,L3). Signal wirings may be realized with multiple conductor layers (L1, L3) to reduce wiring resistance and the upper conductor layer (L3) of the signal wiring may partly overlap the insulating patches (L2). The insulating patches (L2) may extend over the acoustic path to achieve temperature compensation.

公开(公告)号：US12074587B2

公开(公告)日：2024-08-27

申请号：US17597465

申请日：2020-07-09

申请人： RF360 SINGAPORE PTE. LTD.

发明人： Florian Habel ,  Thomas Bauer ,  Peter Hagn ,  Thomas Dengler

IPC分类号： H03H9/72 ,  H03H9/02 ,  H03H9/05 ,  H03H9/25 ,  H03H9/56

CPC分类号： H03H9/725 ,  H03H9/02559 ,  H03H9/058 ,  H03H9/25 ,  H03H9/568 ,  H03H9/02834

摘要： At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.