Stealth-dicing compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices

    公开(公告)号:US10090820B2

    公开(公告)日:2018-10-02

    申请号:US15078138

    申请日:2016-03-23

    Abstract: Stealth-dicing-compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices are disclosed. An acoustic wave device comprises a substrate having opposing top and bottom surfaces, where a first portion of the bottom surface has a higher roughness than a second portion of the bottom surface, and an acoustic resonator over the top surface of the substrate. The acoustic resonator comprises a piezoelectric layer having opposing top and bottom surfaces and a plurality of electrodes, at least some of which are disposed on the top surface of the piezoelectric layer. The first portion of the bottom surface of the substrate is below and opposite from the acoustic resonator, and the second portion of the bottom surface of the substrate is not located below and opposite from the acoustic resonator. Multiple first portions, each separated from the other by second portions, may exist.

    STEALTH-DICING COMPATIBLE DEVICES AND METHODS TO PREVENT ACOUSTIC BACKSIDE REFLECTIONS ON ACOUSTIC WAVE DEVICES
    2.
    发明申请
    STEALTH-DICING COMPATIBLE DEVICES AND METHODS TO PREVENT ACOUSTIC BACKSIDE REFLECTIONS ON ACOUSTIC WAVE DEVICES 审中-公开
    相关的兼容设备和防止声音波形设备上的声音反射反射的方法

    公开(公告)号:US20170033768A1

    公开(公告)日:2017-02-02

    申请号:US15078138

    申请日:2016-03-23

    CPC classification number: H03H3/04 H03H3/08 H03H9/02055 H03H9/02622

    Abstract: Stealth-dicing-compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices are disclosed. An acoustic wave device comprises a substrate having opposing top and bottom surfaces, where a first portion of the bottom surface has a higher roughness than a second portion of the bottom surface, and an acoustic resonator over the top surface of the substrate. The acoustic resonator comprises a piezoelectric layer having opposing top and bottom surfaces and a plurality of electrodes, at least some of which are disposed on the top surface of the piezoelectric layer. The first portion of the bottom surface of the substrate is below and opposite from the acoustic resonator, and the second portion of the bottom surface of the substrate is not located below and opposite from the acoustic resonator. Multiple first portions, each separated from the other by second portions, may exist.

    Abstract translation: 公开了用于防止声波装置上的声学背面反射的隐形切割兼容装置和方法。 声波装置包括具有相对的顶表面和底表面的基底,其中底表面的第一部分具有比底表面的第二部分更高的粗糙度,以及在基底顶表面上的声共振器。 声谐振器包括具有相对的顶表面和底表面的压电层和多个电极,其中至少一些电极设置在压电层的顶表面上。 衬底的底表面的第一部分在声谐振器的下面和相对之间,并且衬底的底表面的第二部分不位于声谐振器的下方和相对的位置。 可以存在多个第一部分,每个第一部分通过第二部分彼此分开。

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