-
公开(公告)号:US20230243037A1
公开(公告)日:2023-08-03
申请号:US17587354
申请日:2022-01-28
CPC分类号: C23C16/52 , C23C16/045 , C23C16/56 , C23C16/0272
摘要: A method of improving surface roughness of ceramic matrix composites (CMCs) is provided. The method includes completing a formation of the CMCs and a chemical vapor infiltration (CVI) process to initially coat the CMCs, inspecting a CMC surface, identifying, from a result of the inspecting, a defect in the CMC surface that negatively impacts a surface roughness characteristic thereof, locally targeting and ablating the defect and re-inspecting the CMC surface to ensure that the defect is correct.
-
公开(公告)号:US20230265763A1
公开(公告)日:2023-08-24
申请号:US17675543
申请日:2022-02-18
IPC分类号: F01D11/08 , F01D25/00 , B28B1/30 , B28B11/04 , B28B11/12 , C04B35/83 , C04B35/628 , C04B41/45 , C04B41/81
CPC分类号: F01D11/08 , F01D25/005 , B28B1/30 , B28B11/04 , B28B11/12 , C04B35/83 , C04B35/62873 , C04B35/62868 , C04B35/62863 , C04B35/62892 , C04B35/62884 , C04B41/4578 , C04B41/81 , F05D2220/32 , F05D2230/20 , F05D2240/55 , C04B2235/5248 , C04B2235/5256 , C04B2235/422 , C04B2235/386 , C04B2235/3826 , C04B2235/612 , C04B2235/614
摘要: A method of forming a ceramic matrix composite component according to an exemplary embodiment of this disclosure, among other possible things includes laying up plies of ceramic reinforcement material with sacrificial plies to form a preform, infiltrating the preform with a ceramic matrix material, and machining away the sacrificial plies to reveal a surface profile of the ceramic matrix composite component. A preform for a ceramic matrix composite component is also disclosed.
-
公开(公告)号:US20230193772A1
公开(公告)日:2023-06-22
申请号:US17557224
申请日:2021-12-21
发明人: Zhigang Wang , John D. Riehl , Andrew J. Lazur , Robin H. Fernandez , Paul F. Croteau , Gajawalli V. Srinivasan , Ashley A. Smith
IPC分类号: F01D9/06 , B23K26/382 , B23K26/146 , B23B35/00 , G06F30/20
CPC分类号: F01D9/065 , B23K26/389 , B23K26/146 , B23B35/00 , G06F30/20 , F05D2220/32 , F05D2230/13 , B23K2103/52
摘要: A method of machining cooling holes includes providing a workpiece in which a cooling hole is to be formed. The cooling hole, once formed, defines distinct first and second sections. The workpiece is secured in a fixture that is mounted in a first machine. In the first machine, a laser is used to drill a through-hole in a wall of the workpiece. The through-hole is spatially common to the first and second sections of the cooling hole. After drilling the through-hole, the fixture with the workpiece secured therein is removed from the first machine and mounted in a second machine. In the second machine, ultrasonic machining is used to expand a portion of the through-hole to form the second section. An abrasive slurry used in the process is drained through the through-hole during the ultrasonic machining.
-
-