公开(公告)号：US20210197325A1

公开(公告)日：2021-07-01

申请号：US17200168

申请日：2021-03-12

Applicant: RAYTHEON COMPANY

Inventor： Sergio V. Martinez ,  Jeffrey R. Ogorzalek ,  Patrick J. Lott

IPC: B23K37/06 ,  B23K1/00 ,  B23K3/06 ,  H05K3/32 ,  H05K3/34

Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

公开(公告)号：US11033990B2

公开(公告)日：2021-06-15

申请号：US16203815

申请日：2018-11-29

Applicant: RAYTHEON COMPANY

Inventor： Sergio V. Martinez ,  Jeffrey R. Ogorzalek ,  Patrick J. Lott

IPC: B23K1/00 ,  B23K37/06 ,  B23K3/06 ,  H05K3/32 ,  H05K3/34 ,  B23K101/42

Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

公开(公告)号：US20200171609A1

公开(公告)日：2020-06-04

申请号：US16203815

申请日：2018-11-29

Applicant: RAYTHEON COMPANY

Inventor： Sergio V. Martinez ,  Jeffrey R. Ogorzalek ,  Patrick J. Lott

IPC: B23K37/06 ,  H05K3/34 ,  H05K3/32 ,  B23K1/00 ,  B23K3/06

Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.