公开(公告)号：US11095090B2

公开(公告)日：2021-08-17

申请号：US16026963

申请日：2018-07-03

Applicant: Qingdao Hisense Laser Display Co., Ltd.

Inventor： Longfei Shi ,  Xintuan Tian

IPC: H01S3/23 ,  H01S3/04

Abstract: A laser module includes an encapsulating support, at least one laser, a sealing gasket, and a pressing plate. Each laser includes a supporting plate and a laser body that is fixed to the supporting plate. The supporting plate is fixed on the encapsulating support, and a surface of an end of the laser body away from the supporting plate is a light exit end face. The sealing gasket is located on a surface of the supporting plate close to the light exit end face, and the sealing gasket has a first opening at a position corresponding to the laser body. A pressing plate is located on a surface of the sealing gasket away from the supporting plate; the pressing plate is fixedly connected to the encapsulating support, and the pressing plate has a second opening at a position corresponding to the first opening.

公开(公告)号：US20190288480A1

公开(公告)日：2019-09-19

申请号：US16026963

申请日：2018-07-03

Applicant: Qingdao Hisense Laser Display Co., Ltd.

Inventor： Longfei Shi ,  Xintuan Tian

IPC: H01S3/23 ,  H01S3/04

Abstract: A laser module includes an encapsulating support, at least one laser, a sealing gasket, and a pressing plate. Each laser includes a supporting plate and a laser body that is fixed to the supporting plate. The supporting plate is fixed on the encapsulating support, and a surface of an end of the laser body away from the supporting plate is a light exit end face. The sealing gasket is located on a surface of the supporting plate close to the light exit end face, and the sealing gasket has a first opening at a position corresponding to the laser body. A pressing plate is located on a surface of the sealing gasket away from the supporting plate; the pressing plate is fixedly connected to the encapsulating support, and the pressing plate has a second opening at a position corresponding to the first opening.