公开(公告)号：US20220149005A1

公开(公告)日：2022-05-12

申请号：US17094303

申请日：2020-11-10

Applicant: QUALCOMM Incorporated

Inventor： Yangyang SUN ,  Li-Sheng WENG ,  Zhimin SONG

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31

Abstract: A package comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, an interconnect integrated device coupled to the first integrated device and the second integrated device, and an underfill. The substrate includes a cavity. The interconnect integrated device is located over the cavity of the substrate. The underfill is located (i) between the first integrated device and the substrate, (ii) between the second integrated device and the substrate, (iii) between the interconnect integrated device and the first integrated device, and (iv) between the interconnect integrated device and the second integrated device.