公开(公告)号：US20200211943A1

公开(公告)日：2020-07-02

申请号：US16453803

申请日：2019-06-26

Applicant: QUALCOMM Incorporated

Inventor： Abdolreza LANGARI ,  Yuan LI ,  Shrestha GANGULY ,  Terence CHEUNG ,  Ching-Liou HUANG ,  Hui WANG

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/18 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00

Abstract: A device that includes a first die and a package substrate. The package substrate includes a dielectric layer, a plurality of vias formed in the dielectric layer, a first plurality of interconnects formed on a first metal layer of the package substrate, and a second plurality of interconnects formed on a second metal layer of the package substrate. The device includes a first series of first solder interconnects arranged in a first direction, the first series of first solder interconnects configured to provide a first electrical connection; a second series of first solder interconnects arranged in the first direction, the second series of first solder interconnects configured to provide a second electrical connection; a first series of second solder interconnects arranged in a second direction, the first series of second solder interconnects configured to provide the first electrical connection.

公开(公告)号：US20250044806A1

公开(公告)日：2025-02-06

申请号：US18706710

申请日：2022-01-25

Applicant: QUALCOMM Incorporated

Inventor： Yuan LI ,  Zhi CHEN

IPC: G05D1/249 ,  G05D111/10 ,  G05D111/30 ,  G06V20/40 ,  H04W24/10 ,  H04W64/00

Abstract: Methods for loop closure detection performed by a processor of a robotic device may include maneuvering the robotic device through a plurality of locations, determining a location of the robotic device at each of the plurality of locations using a round trip time (RTT) measurement of a signal sent to an access point, determining whether a location of the robotic device is within a threshold distance of a previously-visited one of the plurality of locations, and performing visual loop closure detection in response to determining that the location of the robotic device is within the threshold distance of the previously-visited one of the plurality of locations.

公开(公告)号：US20230036650A1

公开(公告)日：2023-02-02

申请号：US17386278

申请日：2021-07-27

Applicant: QUALCOMM Incorporated

Inventor： Yuan LI ,  Aniket PATIL ,  Hong Bok WE ,  Abdolreza LANGARI ,  Lisha ZHANG

IPC: H01L23/60 ,  H01L21/50 ,  H01L23/522

Abstract: In an aspect, a semiconductor includes a substrate. The substrate includes a column comprising a conductive paste that passes through a plurality of metal layers, a resin sheath surrounding the column, a ground shield surrounding the resin sheath, and a plurality of sense lines. The plurality of sense lines include a first sense line that is connected to the column comprising the conductive paste and a second sense line that is connected to the ground shield. The resin comprises a dielectric material.

公开(公告)号：US20210066177A1

公开(公告)日：2021-03-04

申请号：US16949695

申请日：2020-11-11

Applicant: QUALCOMM Incorporated

Inventor： Abdolreza LANGARI ,  Yuan LI ,  Shrestha GANGULY ,  Terence CHEUNG ,  Ching-Liou HUANG ,  Hui WANG

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/18 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00

Abstract: A device that includes a first die and a package substrate. The package substrate includes a dielectric layer, a plurality of vias formed in the dielectric layer, a first plurality of interconnects formed on a first metal layer of the package substrate, and a second plurality of interconnects formed on a second metal layer of the package substrate. The device includes a first series of first solder interconnects arranged in a first direction, the first series of first solder interconnects configured to provide a first electrical connection; a second series of first solder interconnects arranged in the first direction, the second series of first solder interconnects configured to provide a second electrical connection; a first series of second solder interconnects arranged in a second direction, the first series of second solder interconnects configured to provide the first electrical connection.

公开(公告)号：US20240212308A1

公开(公告)日：2024-06-27

申请号：US18069993

申请日：2022-12-21

Applicant: QUALCOMM Incorporated

Inventor： Yuan LI ,  Lei WANG ,  Leulseged Tesfaye ALEMU ,  Dashan GAO ,  Ning BI

IPC: G06V10/26 ,  G06V10/77 ,  G06V10/82 ,  G06V40/16

CPC classification number: G06V10/267 ,  G06V10/7715 ,  G06V10/82 ,  G06V40/172

Abstract: System and techniques are described herein for processing images to detect objects in the provided images. In one illustrative example, a method of processing image data includes obtaining an image including at least a first object. The method can include generating a feature map based on providing the image to a neural network. The method can further include identifying a plurality of objects based on the feature map, the plurality of objects including a first part of the first object. The method can include identifying a first set of object parts within the plurality of objects corresponding to the first object.