公开(公告)号：US20220231641A1

公开(公告)日：2022-07-21

申请号：US17152641

申请日：2021-01-19

Applicant: QUALCOMM Incorporated

Inventor： Wai Lim NGAI ,  Jeremy Darren DUNWORTH

IPC: H03F3/21

Abstract: Certain aspects of the present disclosure provide an amplification system. The amplification system generally includes: a first amplifier having an output coupled to an output of the amplification system; a second amplifier, inputs of the first amplifier and the second amplifier being coupled to an input of the amplification system; an impedance coupled to an output of the second amplifier; and a biasing circuit having a first voltage sense input coupled to the output of the first amplifier, a second voltage sense input coupled to the output of the second amplifier, and an output coupled to a bias input of the first amplifier.

公开(公告)号：US20180226924A1

公开(公告)日：2018-08-09

申请号：US15424603

申请日：2017-02-03

Applicant: QUALCOMM Incorporated

Inventor： Wai Lim NGAI ,  Jeremy GOLDBLATT

IPC: H03F3/21 ,  H03F1/02 ,  H03F3/19

CPC classification number: H03F3/21 ,  H03F1/0205 ,  H03F1/0277 ,  H03F3/19 ,  H03F3/211 ,  H03F3/72 ,  H03F2200/294 ,  H03F2200/451

Abstract: An amplification circuit includes: an input stage including a driver; a transformer that includes a primary winding and a secondary winding, the primary winding being coupled to an output of the driver; and an output stage including: an output configured to be coupled to a load; and a plurality of paths coupled to the output and coupled to respective taps of the secondary winding; where at least one of the plurality of paths comprises a power amplifier.