公开(公告)号：US20220320026A1

公开(公告)日：2022-10-06

申请号：US17213875

申请日：2021-03-26

Applicant: QUALCOMM Incorporated

Inventor： Yangyang SUN ,  Rong ZHOU ,  Li-Sheng WENG ,  Lily ZHAO

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/538 ,  H01L25/065 ,  H01L23/31

Abstract: A package that includes a substrate comprising a cavity, a first integrated device coupled to the substrate through a first plurality of pillar interconnects and a first plurality of solder interconnects, a second integrated device coupled to the substrate through a second plurality of pillar interconnects and a second plurality of solder interconnects, and a plurality of wire bonds coupled to the first integrated device and the second integrated device, wherein the plurality of wire bonds is located over the cavity of the substrate.

公开(公告)号：US20220285280A1

公开(公告)日：2022-09-08

申请号：US17191557

申请日：2021-03-03

Applicant: QUALCOMM Incorporated

Inventor： Rong ZHOU ,  William M. ADERHOLDT

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: An integrated circuit (IC) package including ICs with multi-row columnar die interconnects has increased die-to-die (D2D) interconnect density in a conductive layer. Positioning the die interconnects in die interconnect column clusters, that each include a plurality of die interconnect rows and two columns, reduces the linear dimension occupied by the die interconnects and leaves room for more D2D interconnects. A die interconnect column cluster pitch is a distance between columns of adjacent die interconnect column clusters and this distance is greater than a die interconnect pitch between columns within the column clusters. Die interconnects may be disposed in the space between the multi-row column clusters and additional die interconnects can be disposed at the D2D interconnect pitch between the die interconnect column clusters. IC packages with ICs including the multi-row columnar die interconnects have a greater number of D2D interconnects for better IC integration.