公开(公告)号：US20240206066A1

公开(公告)日：2024-06-20

申请号：US18069004

申请日：2022-12-20

Applicant: QUALCOMM Incorporated

Inventor： Christopher Kong Yee Chun ,  Mid Deng ,  John Eaton

IPC: H05K1/14 ,  H01R12/71 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  H01R12/714 ,  H05K3/3442 ,  H05K3/368

Abstract: A hybrid circuit board device includes a hybrid circuit board with a second, child circuit board disposed into a recessed circuit board portion of a first, parent circuit board to combine functionality of the child circuit board and the parent circuit board without exceeding a maximum circuit board height. The parent circuit board includes a first circuit board portion having a first thickness in a thickness direction. First interconnects on the first circuit board portion can couple to a first IC component. The child circuit board includes second interconnects to couple a second IC component. The child circuit board is in the recessed circuit board portion and is coupled to the parent circuit board by at least one board interconnect. The recessed circuit board portion of the parent circuit board has a second thickness that is thinner, in the thickness direction, than the first thickness.