公开(公告)号：US20200160018A1

公开(公告)日：2020-05-21

申请号：US16197494

申请日：2018-11-21

Applicant: QUALCOMM Incorporated

Inventor： Hrishikesh Panchawagh ,  Kostadin Djordjev

IPC: G06K9/00 ,  H01L41/08 ,  H01L27/20 ,  H01L41/25 ,  H01L41/113 ,  B06B1/06

Abstract: The described architecture and techniques may provide for ultrasonic sensing using transmit and receive beamforming using an ultrasonic sensor with a continuous (e.g., non-segmented) blanket layer of piezo-sensitive material between a common electrode and an array of electrodes. For example, an ultrasonic biometric sensor may utilize a continuous blanket layer of piezo-sensitive material (e.g., such as a continuous copolymer, in lieu of an array of piezoelectric elements) between a common electrode and an electrode array for transmit and receive beamforming. The electrode array may employ individual transmission cycle control for each electrode to perform aspects of ultrasonic transmit and receive beamforming for biometric sensing/imaging. The continuous copolymer (e.g., or other blanket layer of piezo-sensitive material) may provide for a thin layer, between the common electrode and the electrode array, with desirable material properties to isolate each pixel from neighboring pixels and enable effective ultrasonic transmit and receive beamforming.