公开(公告)号：US20210057397A1

公开(公告)日：2021-02-25

申请号：US16546158

申请日：2019-08-20

Applicant: QUALCOMM Incorporated

Inventor： Kuiwon KANG ,  Seongryul CHOI ,  Haekyun KIM

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/13 ,  H01L23/00 ,  H01L21/48

Abstract: An electronic assembly is disclosed that includes an electrodeless passive component embedded in a cavity of a multilayer substrate, wherein the cavity has conductive elements formed on at least two sidewalls of the cavity. The conductive elements are configured to be electrically coupled to the electrodeless passive component. The electrodeless passive component may be located in a first metal layer adjacent an external surface of the multilayer substrate.