公开(公告)号：US20220026474A1

公开(公告)日：2022-01-27

申请号：US16935092

申请日：2020-07-21

Applicant: QUALCOMM Incorporated

Inventor： Stefano FACCHIN ,  Baptiste GRAVE ,  Bharani CHAVA ,  David Jonathan WALSHE

IPC: G01R19/165 ,  H01L23/528 ,  H01L27/092 ,  H01L29/24 ,  H01L29/786

Abstract: An IC is provided. The IC includes a power grid including Mx layer interconnects extending in a first direction on an Mx layer and Mx+1 layer interconnects extending in a second direction orthogonal to the first direction on an Mx+1 layer, where x>5. In addition, the IC includes a plurality of power switches. Further, the IC includes at least one sensing element located between the Mx layer and the Mx+1 layer and configured to measure a voltage drop to devices powered by the plurality of power switches. The one or more of the plurality of power switches may be located below the power grid. The power switches of the plurality of power switches may be adjacent in the first direction and in the second direction to each sensing element of the at least one sensing element.