公开(公告)号：US20130122833A1

公开(公告)日：2013-05-16

申请号：US13677054

申请日：2012-11-14

Applicant: QUALCOMM Incorporated

Inventor： Aristotele Hadjichristos ,  Gurkanwal Singh Sahota ,  Steven C Ciccarelli ,  David J Wilding ,  Ryan D Lane ,  Christian Holenstein ,  Milind P Shah

IPC: H05K3/36 ,  H05K13/04 ,  H04B1/40

CPC classification number: H05K3/368 ,  H01L23/66 ,  H01L25/16 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H04B1/40 ,  H05K13/0465 ,  Y10T29/49126 ,  Y10T29/5317 ,  H01L2924/00

Abstract: A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package. The first radio frequency package includes radio frequency components. The radio frequency package on package (PoP) circuit also includes a second radio frequency package. The second radio frequency package includes radio frequency components. The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.

Abstract translation: 描述了封装（PoP）电路上的射频封装。 封装（PoP）电路上的射频封装包括第一射频封装。 第一个射频包包括射频分量。 封装（PoP）电路上的射频封装还包括第二个射频封装。 第二个射频包包括射频分量。 第一射频包和第二射频包处于垂直配置。 第一个射频封装上的射频分量被设计为减少接地电感的影响。

公开(公告)号：US09131634B2

公开(公告)日：2015-09-08

申请号：US13677054

申请日：2012-11-14

Applicant: QUALCOMM Incorporated

Inventor： Aristotele Hadjichristos ,  Gurkanwal Singh Sahota ,  Steven C Ciccarelli ,  David J Wilding ,  Ryan D Lane ,  Christian Holenstein ,  Milind P Shah

IPC: H04B5/00 ,  H05K3/36 ,  H04B1/40 ,  H05K13/04 ,  H01L23/66 ,  H01L25/16

CPC classification number: H05K3/368 ,  H01L23/66 ,  H01L25/16 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H04B1/40 ,  H05K13/0465 ,  Y10T29/49126 ,  Y10T29/5317 ,  H01L2924/00

Abstract: A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package. The first radio frequency package includes radio frequency components. The radio frequency package on package (PoP) circuit also includes a second radio frequency package. The second radio frequency package includes radio frequency components. The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.

Abstract translation: 描述了封装（PoP）电路上的射频封装。 封装（PoP）电路上的射频封装包括第一射频封装。 第一个射频包包括射频分量。 封装（PoP）电路上的射频封装还包括第二个射频封装。 第二个射频包包括射频分量。 第一射频包和第二射频包处于垂直配置。 第一个射频封装上的射频分量被设计为减少接地电感的影响。