公开(公告)号：US10651160B2

公开(公告)日：2020-05-12

申请号：US15867518

申请日：2018-01-10

Applicant: QUALCOMM Incorporated

Inventor： Kuiwon Kang ,  Houssam Jomaa ,  Christopher Bahr ,  Layal Rouhana

IPC: H01L21/48 ,  H01L23/49 ,  H01L23/538 ,  H01L23/31 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00

Abstract: A package that includes a substrate comprising an interposer interconnect and a cavity, a redistribution portion coupled to the substrate, the redistribution comprising a plurality of redistribution interconnects, and a first die coupled to the redistribution portion through the cavity of the substrate. A substantial region between a side surface of the first die and the substrate is free of an encapsulation layer. In some implementations, the substrate is free of a metal ring that surrounds the first die. In some implementations, the redistribution portion comprises a barrier layer and a first interconnect coupled to the barrier layer. The barrier layer is coupled to the interposer interconnect.