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公开(公告)号:US20190115386A1
公开(公告)日:2019-04-18
申请号:US16161958
申请日:2018-10-16
Applicant: QUALCOMM Incorporated
Inventor: Jian MA , Biay-Cheng HSEIH , Sergiu Radu GOMA
IPC: H01L27/146 , H04N5/225 , H04N5/369
Abstract: Various embodiments are directed to a light pipe. The light pipe may include a channel within a substrate of an image sensor. The channel may be formed by a plurality of layers. The plurality of layers may include a first layer and a second layer. The second layer may be spaced apart from the first layer along an axis of the channel.
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公开(公告)号:US20240125975A1
公开(公告)日:2024-04-18
申请号:US18483273
申请日:2023-10-09
Applicant: QUALCOMM Incorporated
Inventor: Matthieu Jean Olivier DUPRE , Biay-Cheng HSEIH , Jian MA , Sergiu Radu GOMA
CPC classification number: G02B1/002 , G02B3/0012 , G02B27/0012
Abstract: Systems and techniques are provided for imaging with a meta-lens. For instance, a process can include receiving light at a first substrate, the first substrate comprising a first meta-lens; receiving a first portion of the light at a second substrate, the second substrate including an optical sensor, wherein: the optical sensor is directly covered by a solid covering, and the first substrate is mechanically coupled to the second substrate such that the solid covering is between the first substrate and the second substrate; and receiving, by the optical sensor and through the solid covering, at least a second portion of the light focused by the first meta-lens.
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公开(公告)号:US20190096932A1
公开(公告)日:2019-03-28
申请号:US15713217
申请日:2017-09-22
Applicant: QUALCOMM Incorporated
Inventor: Biay-Cheng HSEIH , Todor Georgiev GEORGIEV , Jian MA , Sergiu GOMA
IPC: H01L27/146 , H01L31/0216 , H04N5/374
Abstract: Various embodiments are directed to an image sensor that includes a first sensor portion and a second sensor portion. The second sensor portion may be positioned relative to the first sensor portion such that the second sensor portion may initially detect light entering the image sensor, and some of that light passes through the second sensor portion and may be detected by the first sensor portion. In some embodiments, one more optical filters may be disposed within the image sensor. The one or more optical filters may include at least one of a dual bandpass filter disposed above the second photodetector or a narrow bandpass filter disposed between the first photodetector and the second photodetector.
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公开(公告)号:US20230012003A1
公开(公告)日:2023-01-12
申请号:US17857790
申请日:2022-07-05
Applicant: QUALCOMM Incorporated
Inventor: Jian MA , Biay-Cheng HSEIH , Matthieu Jean Olivier DUPRE , Sergiu Radu GOMA
Abstract: Systems and techniques are provided for meta-lens cameras. For example, an apparatus can include a first substrate including a first aperture and a second substrate including a first meta-lens. The first substrate and the second substrate are mechanically coupled such that at least a first portion of the first aperture is disposed over at least a second portion of the first meta-lens.
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公开(公告)号:US20220245762A1
公开(公告)日:2022-08-04
申请号:US17166990
申请日:2021-02-03
Applicant: QUALCOMM Incorporated
Inventor: Jian MA , Sergiu Radu GOMA , Biay-Cheng HSEIH
Abstract: Techniques and systems are provided for high resolution time-of-flight (ToF) depth imaging. In some examples, an apparatus includes a projection system including one or more light-emitting devices, each light-emitting device being configured to illuminate at least one portion of an entire field-of-view (FOV) of the projection system. The entire FOV includes a plurality of FOV portions. The apparatus also includes a receiving system including a sensor configured to sequentially capture a plurality of images based on a plurality of illumination reflections corresponding to light emitted by the one or more light-emitting devices. Each image of the plurality of images corresponds to one of the plurality of FOV portions. An image resolution associated with each image corresponds to a full resolution of the sensor. The apparatus further includes a processor configured to generate, using the plurality of images, an increased resolution depth map associated with the entire FOV.
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公开(公告)号:US20210210543A1
公开(公告)日:2021-07-08
申请号:US16735084
申请日:2020-01-06
Applicant: QUALCOMM Incorporated
Inventor: Biay-Cheng HSEIH , Sergiu Radu GOMA
IPC: H01L27/146 , H04N5/369 , G01S17/86 , G01S17/894
Abstract: Aspects of the present disclosure relate to an image sensor. An example apparatus includes an image sensor including one or more pixels. Each pixel of the one or more pixels includes a photodetector, and the photodetector includes a photosensitive surface including germanium. In some implementations, the photodetector includes a photodiode including an intrinsic silicon layer doped with germanium or including germanium crystals. The intrinsic layer may be between a p− layer and an n− layer not including germanium. The intrinsic layer may be configured to absorb photons of the light received at the intrinsic layer. The light may include one or more reflections of an emitted light for active depth sensing. For example, the emitted light may be frequency modulated and having a first wavelength for indirect time-of-flight depth sensing. Sampling circuits may generate voltages indicating a phase difference between the emitted light and a reflection of the emitted light.
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公开(公告)号:US20210067705A1
公开(公告)日:2021-03-04
申请号:US17003807
申请日:2020-08-26
Applicant: Qualcomm Incorporated
Inventor: Micha Galor Gluskin , Biay-Cheng HSEIH
Abstract: Various embodiments are directed to a device including an infrared phase detection autofocus (PDAF) sensor. The device may include a projector configured to transmit a source light onto a scene. The device may include the infrared PDAF sensor configured to receive reflections of the source light off of objects within the scene. The infrared PDAF sensor may include a first set of pixels including focus pixels. The device may include a processor coupled to the infrared PDAF sensor and a memory. The processor may be configured to generate first depth data based on the received reflections of the source light. The processor may be configured to generate second depth data based on signals generated from corresponding pairs of the focus pixels. The processor may be configured to generate combined depth data based on the first depth data and the second depth data.
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