公开(公告)号：US20210098320A1

公开(公告)日：2021-04-01

申请号：US16590299

申请日：2019-10-01

Applicant: QUALCOMM Incorporated

Inventor： Daniel GARCIA ,  Kinfegebriel Amera MENGISTIE ,  Francesco CARRARA ,  Chang-Ho LEE ,  Ashish ALAWANI ,  Mark KUHLMAN ,  John Jong-Hoon LEE ,  Jeongkeun KIM ,  Xiaoju YU ,  Supatta NIRAMARNKARN

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.