公开(公告)号：US11042174B2

公开(公告)日：2021-06-22

申请号：US15424661

申请日：2017-02-03

Applicant: QUALCOMM INCORPORATED

Inventor： Vivek Sahu ,  Don Le ,  Jon Anderson ,  Peng Wang ,  Shujuan Wang

IPC: G05D23/19 ,  A61B5/1455 ,  A61B5/00 ,  G06F1/3231 ,  G06F1/20 ,  H04W52/02 ,  G06F1/16

Abstract: Because the touch temperature of a wearable computing device (“WCD”) may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

公开(公告)号：US10606327B2

公开(公告)日：2020-03-31

申请号：US15624877

申请日：2017-06-16

Applicant: QUALCOMM Incorporated

Inventor： Victor Chiriac ,  Jorge Rosales ,  Peng Wang

IPC: H05K7/20 ,  H01L23/367 ,  G06F1/20 ,  G03B17/55

Abstract: Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.

公开(公告)号：US10267545B2

公开(公告)日：2019-04-23

申请号：US15086039

申请日：2016-03-30

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter

IPC: G06F1/20 ,  F25B21/04 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32

Abstract: An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.

公开(公告)号：US10152099B2

公开(公告)日：2018-12-11

申请号：US14594984

申请日：2015-01-12

Applicant: QUALCOMM Incorporated

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Jon James Anderson ,  Vinay Mitter ,  Peng Wang

IPC: G06F1/20 ,  H05K7/20 ,  C09K5/14 ,  G06F1/16 ,  G06F1/18 ,  F28F13/00

Abstract: An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

公开(公告)号：US11437328B2

公开(公告)日：2022-09-06

申请号：US16874542

申请日：2020-05-14

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Le Gao ,  Jorge Luis Rosales ,  Don Le

IPC: H01L23/552 ,  H01L23/427 ,  H01L25/065 ,  H01L21/48 ,  H01L23/00

Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

公开(公告)号：US09746889B2

公开(公告)日：2017-08-29

申请号：US14709276

申请日：2015-05-11

Applicant: QUALCOMM Incorporated

Inventor： Rajat Mittal ,  Hee Jun Park ,  Peng Wang ,  Mehdi Saeidi ,  Arpit Mittal

IPC: H01L29/15 ,  H01L21/20 ,  G06F1/20 ,  H01L23/34 ,  H01L23/38 ,  H01L25/065 ,  H01L25/10 ,  G01K7/04 ,  G05D23/19 ,  H01L23/498 ,  H01L23/367

CPC classification number: G06F1/206 ,  G01K7/04 ,  G05D23/1906 ,  H01L23/34 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/49811 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1094 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

公开(公告)号：US11975846B2

公开(公告)日：2024-05-07

申请号：US17247546

申请日：2020-12-16

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B64D13/00 ,  B64C39/02 ,  B64D33/08 ,  B64U10/13 ,  B64U30/20 ,  F28D15/02 ,  F28D15/04 ,  F28D21/00

CPC classification number: B64D13/006 ,  B64C39/024 ,  B64D33/08 ,  F28D15/0275 ,  F28D15/04 ,  B64U10/13 ,  B64U30/20 ,  F28D2021/0021

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

公开(公告)号：US20190009878A1

公开(公告)日：2019-01-10

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B64C1/06 ,  B64C39/02

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US20180351066A1

公开(公告)日：2018-12-06

申请号：US15611524

申请日：2017-06-01

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Victor Adrian Chiriac ,  Mario Francisco Velez ,  Peng Wang

IPC: H01L35/32 ,  H01L35/30 ,  H01L35/02 ,  H01L35/34

CPC classification number: H01L35/32

Abstract: A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.

公开(公告)号：US12204113B1

公开(公告)日：2025-01-21

申请号：US18465792

申请日：2023-09-12

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Le Gao ,  Peng Wang ,  Kenneth Baar

IPC: G02B27/01 ,  G02C11/00 ,  G06F1/16 ,  G06F1/20

Abstract: Head-mounted electronic device incorporating a piezo-electric device for dissipation of heat, and related methods of controlling the piezo-electric device to dissipate heat from the head-mounted electronic device are disclosed. To dissipate heat in the head-mounted electronic device, the piezo-electric device is integrated in the head-mounted electronic device and is fluidly coupled to an internal air chamber in the head-mounted electronic device that in fluid communication with an integrated circuit (IC). The piezo-electric device draws the heated air around the IC into the internal chamber that heats air inside the internal chamber. The piezo-electric device is configured to pump heated air in the internal chamber through an outlet to dissipate the heated air from the internal chamber. Dissipation of heated air heated from heat generated from the IC can keep the IC from exceeding its thermal limits and/or prevent the head-mounted electronic device from exceeding its skin temperature limit.