公开(公告)号：US20140251947A1

公开(公告)日：2014-09-11

申请号：US13792094

申请日：2013-03-10

Applicant: QUALCOMM INCORPORATED

Inventor： John H. HONG ,  Kenji NOMURA ,  Je-Hsiung LAN

IPC: C03C15/00

CPC classification number: C03C15/00 ,  B81C1/00547 ,  C03C2218/34 ,  H01L21/31111 ,  H01L21/31116 ,  H01L21/486 ,  H05K3/002

Abstract: A method of etching a glass substrate using an etchant that is reversibly activated to etch only in precise locations in which such etching is desired and is deactivated when outside of these locations. The method involves exposing a first side of the glass substrate to a mixture of chemical substances that includes a neutralized etchant that is photosensitive. The neutralized etchant is formed by reacting a neutralizer with an etchant. The method also includes transmitting light from a direction of a second side of the glass into the mixture of chemical substances. In response to exposure to this light, the etchant is reversibly released from a bond to the neutralizer to form the etchant on predetermined areas of the first side of the glass, wherein the predetermined areas are defined by the dimension of the light.

Abstract translation: 使用蚀刻剂蚀刻玻璃基板的方法，所述蚀刻剂可逆地激活以蚀刻仅在需要这种蚀刻的精确位置中蚀刻，并且在这些位置之外停用。 该方法包括将玻璃基板的第一侧暴露于包含光敏的中和蚀刻剂的化学物质的混合物。 中和的蚀刻剂通过使中和剂与蚀刻剂反应而形成。 该方法还包括将光从玻璃的第二侧的方向传输到化学物质的混合物中。 响应于暴露于该光，蚀刻剂从结合到可逆地释放到中和器，以在玻璃的第一侧的预定区域上形成蚀刻剂，其中预定区域由光的尺寸限定。