Apparatus for clamping a chipper knife
    1.
    发明授权
    Apparatus for clamping a chipper knife 失效
    用于夹紧切片刀的装置

    公开(公告)号:US5649579A

    公开(公告)日:1997-07-22

    申请号:US633588

    申请日:1996-04-17

    IPC分类号: B27L11/00 B27G13/00 B27C1/00

    摘要: The object of the invention is an apparatus for clamping a chipper knife (1) to a rotatable chipper disc (4) or drum so that the back surface (6) of the knife (1) is supported against a knife clamp (2) with a knife spacer (3), and that the knife clamp (2) and knife spacer (3) are movable relative to each other by means of the clamping element (5). The knife clamp (2) is provided with supporting surfaces (11, 12) which the back surface (6) of the knife (1) is adapted to lean against by at least two spaced-apart surfaces (11', 12'). The knife spacer element (3) includes a supporting surface (13) which is adapted to subject a front surface (14) of the knife (1) to a force acting between said supporting surfaces (11, 12) of the knife clamp (2) for bending the knife (1) between said supporting surfaces (11, 12) of the knife clamp (2) towards the knife clamp (2) so as to generate a compression stress in the free section of a front surface (16) of the knife (1).

    摘要翻译: 本发明的目的是一种用于将切片刀(1)夹紧到可旋转的切片盘(4)或滚筒上的装置,使得刀(1)的后表面(6)支撑在刀夹(2)上, 刀间隔件(3),并且刀夹(2)和刀间隔件(3)可通过夹紧元件(5)相对于彼此移动。 刀夹(2)设置有支撑表面(11,12),其中刀(1)的后表面(6)适于通过至少两个间隔开的表面(11',12')倾斜。 刀间隔元件(3)包括支撑表面(13),该支撑表面适于将刀(1)的前表面(14)受到作用在刀夹(2)的支撑表面(11,12)之间的力 ),用于在所述刀夹(2)的所述支撑表面(11,12)之间朝向所述刀夹(2)弯曲所述刀(1),以便在所述刀夹(2)的前表面(16)的自由部分中产生压缩应力 刀(1)。

    Procedure and apparatus for the sorting of wood chips
    3.
    发明授权
    Procedure and apparatus for the sorting of wood chips 失效
    木屑分选程序和设备

    公开(公告)号:US5133507A

    公开(公告)日:1992-07-28

    申请号:US707185

    申请日:1991-05-28

    摘要: A two-stage procedure is disclosed for sorting wood chips. The chips are directed to a gyratory screen in the first stage and to a disc screen in the second stage. The chip flow is divided in the first stage into four fractions of which the first fraction contains mainly oversized chips and is directed to a pin chipper, from which it emerges as suitable-sized chips and is directed back to the gyratory screen of the first stage. The second fraction contains acceptable sized chips and most of the overthick chips and is directed to the second or thickness screening stage. The third fraction consists mainly of acceptable chips and is directed to a pulping process, while the fourth fraction consists mainly of fine particles and is directed to a burning station. In the second or thickness screening stage the chip flow is divided into two fractions of which the rougher fraction comprises overthick chips and is directed via a rock and metal separating device into a slicing machine and then back to the first stage gyratory screen, while the finer fraction comprises acceptable chips and is passed directly to the pulping process.

    摘要翻译: 公开了用于分选木片的两阶段程序。 芯片被引导到第一阶段中的旋转屏幕和第二阶段中的盘屏幕。 芯片流在第一阶段被划分为四个部分,其中第一部分主要包含尺寸过大的芯片,并且被引导到引脚切片器,由此从芯片流出,作为合适尺寸的芯片,并且被引导回到第一阶段的旋转屏幕 。 第二部分包含可接受的大小的芯片和大部分的厚厚的芯片并被引导到第二或厚度筛选阶段。 第三部分主要由可接受的碎片组成,并且被引导到制浆过程,而第四部分主要由细颗粒组成并被引导到燃烧台。 在第二或厚度筛选阶段,芯片流程被分为两部分,其中粗糙部分包括厚厚的碎片,并且经由岩石和金属分离装置被引导到切片机中,然后回到第一阶段旋转筛,而较细的 馏分包括可接受的碎片,并直接通到制浆过程。