公开(公告)号：US4257668A

公开(公告)日：1981-03-24

申请号：US417

申请日：1979-01-02

Applicant: Paul R. Ellis, Jr.

Inventor： Paul R. Ellis, Jr.

IPC: H01R4/02 ,  H01R43/16 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01R13/12

CPC classification number: H05K3/3447 ,  H01R12/718 ,  H01R4/028 ,  H05K3/366 ,  H05K1/0306 ,  H05K2201/10386 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/308 ,  H05K3/306 ,  H05K3/3468

Abstract: An improved edge clip terminal having a first diamond-shaped transition region connecting a plurality of tines, that clip over the edge of a substrate, to a first lead section and having a second diamond-shaped transition region connecting the first lead section to a second lead section. In an assembly, the second lead sections of a plurality of terminals are located in holes in a PC board with the second transition regions resting on the surface of the circuit board. The first lead sections are more narrow than the transition regions and of lengths that are sufficient for preventing solder wicking up them and into the areas of the tines during wave soldering of a circuit board so that a leaded substrate soldered into the circuit board may be tilted without damaging it. In an alternate embodiment of this invention, the lead portion of an edge clip terminal on a substrate has a pair of spaced apart transition regions in it. A first transition region and first length of lead space tines away from a second transition region in a hole in a circuit board for preventing solder wicking up the lead and tines during wave soldering so that the leaded substrate may be tilted without damaging it.

Abstract translation: 一种改进的边缘夹子端子，其具有连接多个尖端的第一菱形过渡区域，该多个尖端夹在衬底的边缘上，到第一引线部分，并且具有将第一引线部分连接到第二引线部分的第二菱形过渡区域 导线部分。 在组件中，多个端子的第二引线部分位于PC板中的孔中，其中第二过渡区域搁置在电路板的表面上。 第一引线部分比过渡区域和长度足够窄，足以防止焊料在电路板的波峰焊接过程中漏起并进入尖端区域，使得焊接到电路板中的引线基板可能倾斜 而不损坏它。 在本发明的替代实施例中，衬底上边缘夹子端子的引线部分在其中具有一对间隔开的过渡区域。 第一过渡区域和引线空间的第一长度离开电路板上的孔中的第二过渡区域，以防止在波峰焊接过程中焊锡引起铅尖和尖峰，使得引线基板可以倾斜而不损坏引线。

公开(公告)号：US4294007A

公开(公告)日：1981-10-13

申请号：US108624

申请日：1979-12-31

Applicant: Paul R. Ellis, Jr.

Inventor： Paul R. Ellis, Jr.

IPC: H01R4/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/366 ,  H01R12/718 ,  H01R4/028 ,  H05K3/3447 ,  H05K1/0306 ,  H05K2201/10386 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/308 ,  H05K3/306 ,  H05K3/3468 ,  Y10T29/49126 ,  Y10T29/49799 ,  Y10T29/4981

Abstract: In this method of fabricating an electrical circuit assembly, a thick film hybrid substrate is held in an inverted position as apertured glass-ceramic beads are placed over the end leads on the substrate. A drop of liquid flux is then applied to the apertures to hold the beads in place. After the flux dries, the leads are inserted into plated-through holes in a circuit board, with the beads locating portions of the leads above the board. Following wave soldering of the board, the beads are fractured with a sharp instrument prior to a cleaning operation which removes bead parts from the soldered assembly. In this manner, the substrate is flexibly mounted in the board so that the substrate can be tilted without damaging it.

Abstract translation: 在这种制造电路组件的方法中，当多孔玻璃陶瓷珠置于衬底上的端引线上时，厚膜混合衬底保持在倒置位置。 然后将一滴液体通量施加到孔以将珠保持在适当位置。 焊剂干燥后，将引线插入到电路板的电镀通孔中，其中引线将引线定位在板上方的部分。 在板的波峰焊之后，在清洁操作之前，珠子用尖锐的工具断裂，从焊接的组件中去除了珠子部件。 以这种方式，基板被柔性地安装在板中，使得基板可以倾斜而不损坏基板。