SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER MODULE, AND WELDING LASER LIGHT SOURCE SYSTEM

    公开(公告)号:US20200006921A1

    公开(公告)日:2020-01-02

    申请号:US16567336

    申请日:2019-09-11

    Abstract: A semiconductor laser device lases in a multiple transverse mode and includes a stacked structure where a first conductivity-side semiconductor layer, an active layer, and a second conductivity-side semiconductor layer are stacked above a substrate. The second conductivity-side semiconductor layer includes a current block layer having an opening that delimits a current injection region. Side faces as a pair are formed in portions of the stacked structure that range from part of the first conductivity-side semiconductor layer to the second conductivity-side semiconductor layer. The active layer has a second width greater than a first width of the opening. The side faces in at least part of the first conductivity-side semiconductor layer are inclined to the substrate. A maximum intensity position in a light distribution of light guided in the stacked structure, in a direction of the normal to the substrate, is within the first conductivity-side semiconductor layer.

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