公开(公告)号：US20240387444A1

公开(公告)日：2024-11-21

申请号：US18786399

申请日：2024-07-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKAHIRO KUMAKAWA ,  DAISUKE SAKURAI

IPC: H01L23/00 ,  H01L25/065

Abstract: A flip-chip mounting structure includes a first member including a first electrode pad, a bump formed on the first electrode pad, a second member including a second electrode pad, and a connection portion formed on the second electrode pad. The first member and the second member are flip-chip mounted, and the first electrode pad and the second electrode pad are electrically connected via the bump and the bonding portion. The bonding portion includes at least a first bonding portion formed in a region sandwiched between a top portion of the bump and the second electrode pad, and a second bonding portion formed in a region surrounding a periphery of the first bonding portion and a region surrounding at least a side surface of the bump. Each of the first bonding portion and the second bonding portion is made of a sintered body of a metal powder.

公开(公告)号：US20190172810A1

公开(公告)日：2019-06-06

申请号：US16199807

申请日：2018-11-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKAHIRO KUMAKAWA

IPC: H01L23/00 ,  B23K35/02 ,  B22F7/06

Abstract: A joined structure includes: a first member; and a second member that faces the first member and that is joined to the first member via a joining layer. The joining layer includes a metal material and a solder material, apart of the metal material has at least one pore, and the solder material is located in a part of an internal area of the at least one pore. Also disclosed is a joining method that makes it possible to produce the joined structure. Further disclosed is a joining material used in the joining method. The joining method makes it possible to achieve non-pressurization sintering processes while maintaining high precise thickness of a joining layer between the first layer and the second layer based on the spacer.

公开(公告)号：US20210383982A1

公开(公告)日：2021-12-09

申请号：US17325274

申请日：2021-05-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： RENKI YAMAZAKI ,  TAKAHIRO KUMAKAWA

IPC: H01G9/15 ,  H01G9/012 ,  H01G9/042 ,  H01G9/07 ,  H01G9/10

Abstract: A capacitor element that has an anode body, a dielectric oxide film layer covering the anode body, and a cathode body formed on the dielectric oxide film layer; an exterior body that covers the capacitor element; a contact layer that is on an anode terminal, which is an end portion of the anode body, and has a surface with a predetermined surface roughness; and an anode-side electrode layer that covers the surface are provided.

公开(公告)号：US20210383981A1

公开(公告)日：2021-12-09

申请号：US17325273

申请日：2021-05-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKAHIRO KUMAKAWA ,  RENKI YAMAZAKI

IPC: H01G9/15 ,  H01G9/10 ,  H01G9/042

Abstract: A method of manufacturing a solid electrolytic capacitor according to the exemplary embodiment of the present disclosure includes a step of exposing a cathode body end portion, which is a portion of a cathode body, from an exterior body covering the cathode body, which is a conductor, and forming a contact electrode, which is a metal film, on the exposed cathode body end portion.